T S 1 3 1 0 3
Regulator
CREG
CPTO
VCC
CVCC
C
CISO CDATA
PTO AD0 AD1
CLK DATA
SUB
SRC
VGG
CVGG
TS13103
SYSP SW1
CSYS DSW1 VAC
LOAD
SW2 SYSM
DSW2
VDD
WD
CSUB
CVDD
Pin Description
Pin Symbol SYSP SYSM SUB SRC VGG SW2 SW2 DATA CLK WD VDD AD0 AD1 PTO SW1 SW1 PAD
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PAD
Function Positive System Voltage Negative System Voltage IC Substrate Bias Switch Driver Supply Return Internal Switch Driver Supply Switch Output Node 2 Switch Output Node 2 Data Output Clock Input Watch Dog Internal Supply 1 Address Select 0 Address Select 1 Power Transfer Output Switch Output Node 1 Switch Output Node 1 Power PAD
Functional Block Diagram
Description Connect CSYS to SYSM
Connect CSUB Capacitor to SYSM Local common supply return Connect Bypass Capacitor CVGG to SRC
AC Coupled Data Output AC Coupled Clock Input Control input for latching vs non-latching Switch Connect Bypass Capacitor CVDD to SYSM For logic 0, must be tied to SYSM on PCB For logic 1, must be tied to VDD on PCB Connect to Power Transfer Capacitor CPTO
Must be floating or connected to SUB
VDD VGG
WD
SRC
PTO
Power Management
AD0 AD1
CLK DATA
Digital Control
OverCurrent
Switch Driver
Watchdog
SYSP SW1
SW2 SYSM
SUB
Figure 1: TS13103 Block Diagram
TS13103 Final Datasheet Rev 2.1 28 July 2016
2 of 16 Semtech Proprietary & Confidential
Absolute Maximum Ratings
Over operating free?air temperature range unless otherwise noted(1, 4) Parameter
Range
Unit
SW1, SW2(2) SYSP, PTO(3) CLK , DATA, VDD, AD1, AD0, WD(3)
-1 to 60
V
-1 to 60
V
-0.3 to 5.5
V
VGG(2)
-0.3 to 5.5
V
SUB(2)
-55 to 0.3
V
Maximum Junction Temperature, TJ MAX
150
?C
Storage Temperature Range, TSTG
-65 to 150
?C
Electrostatic Discharge ? Human Body Model
?2k
V
Electrostatic Discharge ? Charged Device Model
?1.5k
V
Lead Temperature (soldering, 10 seconds)
260
?C
Notes: (1)
(2) (3) (4)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute?maximum?rated conditions for extended periods may affect device reliability. Voltage values are with respect to SRC terminal. Voltage values are with respect to SYSM terminal. ESD testing is performed according to the respective JESD22 JEDEC standard.
Thermal Characteristics
Symbol
Parameter
JA
Thermal Resistance Junction to Air (1)
TJ
Operating Junction Temperature Range
Notes:
(1) Assumes 16 LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD
Value 50
-40 to 125
Unit ?C/W
?C
TS13103 Final Datasheet Rev 2.1 28 July 2016
3 of 16 Semtech Proprietary & Confidential
Recommended Operating Conditions
Symbol
Parameter
VSW FSYS CDATA CISO CPTO CVDD CVGG CSUB CWD CSYS RWD DSW1/2 CLK Drive VCLK TCLK TBIT TRESET
AC Switch Voltage System Supply Voltage Frequency Data Isolation Capacitor Clock Isolation Capacitor Power Transfer Capacitor VDD Bypass Capacitor VGG Bypass Capacitor Sub Capacitor Watch Dog Capacitor VSYS Capacitor Watch Dog Resistor SW 1/2 Schottky Diode (Forward Voltage)
Clock Drive Voltage Clock Period Bit Period Reset Time
Electrical Characteristics
Electrical Characteristics, TJ = -40?C to 125?C (unless otherwise noted)
Symbol
Parameter
Condition
Supply and Power Management
ICLK-STBY
Quiescent current Disable Mode or Latch Mode
ISYSP
System Supply Current
VCLK = 0V, CISO=220pF, FSYS = 60Hz VSW = 24V Latch Mode
VDD
VDD Supply Voltage
With respect to VSYS
VGG
VGG Supply Voltage
With respect to SRC
TDOFF
Dither Off Period
TDRTY
Dither Retry Interval
VDON
Dither Voltage ON Threshold
VDOFF
Dither Voltage OFF Threshold
Communication Parameters
THB
Heartbeat Pulse-width
Output Switch
RON
Switch On Resistance
TJ=25?C
IOFF IOUTOC
Off State Leakage Output Over Current Shutdown
TJ ................
................
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