T S 1 3 1 0 3

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Regulator

CREG

CPTO

VCC

CVCC

C

CISO CDATA

PTO AD0 AD1

CLK DATA

SUB

SRC

VGG

CVGG

TS13103

SYSP SW1

CSYS DSW1 VAC

LOAD

SW2 SYSM

DSW2

VDD

WD

CSUB

CVDD

Pin Description

Pin Symbol SYSP SYSM SUB SRC VGG SW2 SW2 DATA CLK WD VDD AD0 AD1 PTO SW1 SW1 PAD

Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

PAD

Function Positive System Voltage Negative System Voltage IC Substrate Bias Switch Driver Supply Return Internal Switch Driver Supply Switch Output Node 2 Switch Output Node 2 Data Output Clock Input Watch Dog Internal Supply 1 Address Select 0 Address Select 1 Power Transfer Output Switch Output Node 1 Switch Output Node 1 Power PAD

Functional Block Diagram

Description Connect CSYS to SYSM

Connect CSUB Capacitor to SYSM Local common supply return Connect Bypass Capacitor CVGG to SRC

AC Coupled Data Output AC Coupled Clock Input Control input for latching vs non-latching Switch Connect Bypass Capacitor CVDD to SYSM For logic 0, must be tied to SYSM on PCB For logic 1, must be tied to VDD on PCB Connect to Power Transfer Capacitor CPTO

Must be floating or connected to SUB

VDD VGG

WD

SRC

PTO

Power Management

AD0 AD1

CLK DATA

Digital Control

OverCurrent

Switch Driver

Watchdog

SYSP SW1

SW2 SYSM

SUB

Figure 1: TS13103 Block Diagram

TS13103 Final Datasheet Rev 2.1 28 July 2016

2 of 16 Semtech Proprietary & Confidential

Absolute Maximum Ratings

Over operating free?air temperature range unless otherwise noted(1, 4) Parameter

Range

Unit

SW1, SW2(2) SYSP, PTO(3) CLK , DATA, VDD, AD1, AD0, WD(3)

-1 to 60

V

-1 to 60

V

-0.3 to 5.5

V

VGG(2)

-0.3 to 5.5

V

SUB(2)

-55 to 0.3

V

Maximum Junction Temperature, TJ MAX

150

?C

Storage Temperature Range, TSTG

-65 to 150

?C

Electrostatic Discharge ? Human Body Model

?2k

V

Electrostatic Discharge ? Charged Device Model

?1.5k

V

Lead Temperature (soldering, 10 seconds)

260

?C

Notes: (1)

(2) (3) (4)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute?maximum?rated conditions for extended periods may affect device reliability. Voltage values are with respect to SRC terminal. Voltage values are with respect to SYSM terminal. ESD testing is performed according to the respective JESD22 JEDEC standard.

Thermal Characteristics

Symbol

Parameter

JA

Thermal Resistance Junction to Air (1)

TJ

Operating Junction Temperature Range

Notes:

(1) Assumes 16 LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD

Value 50

-40 to 125

Unit ?C/W

?C

TS13103 Final Datasheet Rev 2.1 28 July 2016

3 of 16 Semtech Proprietary & Confidential

Recommended Operating Conditions

Symbol

Parameter

VSW FSYS CDATA CISO CPTO CVDD CVGG CSUB CWD CSYS RWD DSW1/2 CLK Drive VCLK TCLK TBIT TRESET

AC Switch Voltage System Supply Voltage Frequency Data Isolation Capacitor Clock Isolation Capacitor Power Transfer Capacitor VDD Bypass Capacitor VGG Bypass Capacitor Sub Capacitor Watch Dog Capacitor VSYS Capacitor Watch Dog Resistor SW 1/2 Schottky Diode (Forward Voltage)

Clock Drive Voltage Clock Period Bit Period Reset Time

Electrical Characteristics

Electrical Characteristics, TJ = -40?C to 125?C (unless otherwise noted)

Symbol

Parameter

Condition

Supply and Power Management

ICLK-STBY

Quiescent current Disable Mode or Latch Mode

ISYSP

System Supply Current

VCLK = 0V, CISO=220pF, FSYS = 60Hz VSW = 24V Latch Mode

VDD

VDD Supply Voltage

With respect to VSYS

VGG

VGG Supply Voltage

With respect to SRC

TDOFF

Dither Off Period

TDRTY

Dither Retry Interval

VDON

Dither Voltage ON Threshold

VDOFF

Dither Voltage OFF Threshold

Communication Parameters

THB

Heartbeat Pulse-width

Output Switch

RON

Switch On Resistance

TJ=25?C

IOFF IOUTOC

Off State Leakage Output Over Current Shutdown

TJ ................
................

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