559/560 Series - Littelfuse

559/560 Series

Fuse Blocks for TE5/TR5 Type Fuses

559 Series Holder

560 Series Holder

Additional Information

Resources 559 Series

Accessories 559 Series

Samples 559 Series

Resources 560 Series

Agency

Accessories 560 Series

Samples 560 Series

Agency Approvals

Agency File Number

559 Series

560 Series

N/A

40041024

N/A

E14721

Fuse Block Datasheet

RoHS

Product Characteristics

559 Series (Lead Free)

560 Series

Compatible Fuses

Materials

TR5/TE5

TR5/TE5

Holder: Black

Holder: Thermoplastic,

Thermoplastic, UL94 V-0 UL 94 V-0

Metal Parts: Copper alloy; solderable tinned

Electrical Data (23?C)

Mounting

Rated Voltage: 250V

Max. Current/Power: 6.3 A /1.6 W

PC Board, 7.18 mm pin PC Board, 5.08 mm pin

spacing

spacing

Solderability max. 260 ?C, 10 s (Wave)

Minimum Cross Section

Conducting path - 0.1 mm2

Unit Weight 0.63 g

0.4 g

Ambient Temperature

-40 ?C to +85 ?C

Ordering Information

Ordering Number 55900000001 55900008011 56000001319 56000001009 56000001019

"A" Height Options 6.5 mm (code 0001) 10 mm (code 8011) 3.0 mm (code 1319) 4.3 mm (code 1009) 4.3 mm (code 1019)

Packaging 1000 Pcs Bulk 100 Pcs Bulk 500 Pcs Bulk 500 Pcs Bulk 1000 Pcs Bulk

Dimensions (Units in mm)

559 Series

? 10

A

0.9

7.18

0.5 1.3?0.1

3.8

1.2 R0.3 7.18

1?0.1 5.2?0.1

Mounting Dimensions

560 Series

? 9.5

A

1.4

1.3

? 1

3.03

5.08 ? 0.5

5.08

1?0.1

R0.75 45

Mounting Dimensions

Application testing is strongly recommended.1

? 2021 Littelfuse, Inc. Specifications are subject to change without notice.

Revised: GD. 05/17/21

559/560 Series

Fuse Blocks for TE5/TR5 Type Fuses

Fuse Block Datasheet

Temperature (?C) - Measured on bottom side of board

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240

Soldering Parameters - Wave Soldering

300 280 260 240 220 200 180 160 140 120 100 80 60 40 20

0

Time (Seconds)

Preheat Time

Dwell Time

Cooling Time

Recommended Process Parameters:

Wave Parameter

Preheat:

(Depends on Flux Activation Temperature)

Temperature Minimum: Temperature Maximum: Preheat Time: Solder Pot Temperature: Solder Dwell Time:

Lead-Free Recommendation

(Typical Industry Recommendation)

100? C 150? C 60-180 seconds 280? C Maximum 2-5 seconds

Recommended Hand-Solder Parameters: Solder Iron Temperature: 350? C +/- 5?C Heating Time: 5 seconds max.

Note: These devices are not recommended for IR or Convection Reflow process.

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: disclaimer-electronics.

? 2021 Littelfuse, Inc.

2

Specifications are subject to change without notice.

Revised: GD. 05/17/21

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