Advanced microprocessor systems
memory stacking using a POP implementation. The OMAP4430 die provides two LPDDR2 interfaces. Each interface supports up to two chip-selects, so up to four LPDDR2 memory dies are supported. Those interfaces are available only on device top ball out. The two stacked memory packages are directly connected to the two LPDDR2 EMIF4D interfaces of the ................
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