Anodic Bonder - University of California, Irvine



Anodic Bonder

Instruction Manual

8/8/03 Heidi Turner

Be certain the high voltage power source is off and the voltage potentiometer has been turned all the way to the right.

Place the ground lead between the two bolts on the center shaft and tighten. Place the high voltage lead under the screw in the back of the bottom plate and tighten. Clean the tip and the plate with acetone. Remove any oxidation build-up from the tip and place the apparatus on the hot plate.

Place the wafers on the bottom plate and center under the tip. Allow the tip to rest on the top wafer.

Cover the bonder with a 1000 ml Pyrex beaker to keep drafts from creating a temperature gradient across the device. Allow a gap in the front and back between beaker and hot plate. Check to be certain that the voltage leads are not resting on the bonder or hot plate.

Turn the hot plate to the desired temperature. The two black multimeters attached to the high voltage devise are for monitoring the temperature. Be certain that the black lead is plugged into the bottom “com” hole and that the red lead is plugged into the opening directly above it. Turn the dial on both to the temp setting.

After the bonder has reached the desired temperature, wait to be certain that the increasing temperature has leveled off.

The yellow multimeters are for monitoring voltage and current. Turn the dial left on the voltage multimeter to the 20 dcv setting. This meter is attached internally to the voltage monitoring pins; never plug anything into the front of it. The reading on the voltage meter is proportionally smaller than the actual output voltage. Multiply the reading by 109 to get an accurate output voltage.

Turn the dial left on the current multimeter to the 200m dcv setting. This meter is also attached internally to the current monitoring pins, never plug anything into the front of it. The reading on the current meter is actually a voltage. The actual output current corresponding to the current reading in volts can be determined from the graph below.

(values taken from the power source tested with 500k resistance)

[pic]

|Anodic Bonder – voltages and currents |

|Power Source |Power Source |Actual Output |Actual Output |

|voltage reading |current reading |voltage |current |

|0.01 v |0.5 mv |000.42 v |0.00 mA |

|0.54 v |0.9 mv |058.9 v |0.13 mA |

|0.99 v |1.2 mv |107.8 v |0.21 mA |

|1.51 v |1.6 mv |165.3 v |0.34 mA |

|2.01 v |2.0 mv |219.7 v |0.45 mA |

|2.52 v |2.3 mv |275.0 v |0.56 mA |

|3.02 v |2.7 mv |330.0 v |0.67 mA |

|3.50 v |3.0 mv |383.0 v |0.77 mA |

|4.00 v |3.4 mv |437.0 v |0.89 mA |

|4.50 v |3.7 mv |492.0 v |1.00 mA |

|5.00 v |4.1 mv |547.0 v |1.10 mA |

|5.50 v |4.4 mv |602.0 v |1.22 mA |

|6.01 v |4.8 mv |658.0 v |1.32 mA |

|6.50 v |5.1 mv |711.0 v |1.44 mA |

|7.00 v |5.5 mv |767.0 v |1.56 mA |

|7.50 v |5.8 mv |822.0 v |1.66 mA |

|8.00 v |6.2 mv |878.0 v |1.77 mA |

|8.50 v |6.5 mv |932.0 v |1.88 mA |

|9.00 v |6.8 mv |986.0 v |1.99 mA |

|9.39 v |7.1 mv |1030.0 v |2.08 mA |

After checking again to be certain the voltage dial is all the way to the right, turn on the high voltage source. Increase the voltage by turning the dial counter-clockwise. Increase the voltage at discrete intervals until the desired voltage is reached.

Leave the device untouched for the desired length of time and then turn off the high voltage power source and the hot plate.

Allow the device to cool to room temperature before removing the Pyrex beaker and the bonded wafers.

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