A New MOSFET Model for the Simulation of Circuits under ...

MOS-AK Workshop, London, March 2014

A New MOSFET Model for the Simulation of Circuits under Mechanical Stress

Heidrun Alius*, Horst Rempp**, Zili Yu** and Thomas Gneiting*

*AdMOS GmbH (Germany), **IMS-CHIPS (Germany)

? Introduction Thin Microsystem

? Background - Piezo electrical effect

? Modeling approach

Verilog-A Implementation Enhancing a standard MOS model for special effects Equations

? Experiments

measurements on bended devices parameter extractions

? Verification with circuits on bended chips

? Summary

Content

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IMS CHIPS in Stuttgart manufactures ultra thin chips with a thickness of 10..20um.

The chips are picked and cracked directly from the wafer using the ChipfilmTM Technology [1]

Silicon chip Thickness: 10..20um

Thin Microsystem

Picture: W?rth Elektronik

Thin flexible Substrate

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Thin chips are embedded in flexible substrates like Polyimide or LCP [2].

The total thickness of the microsystem is 100 ... 150um.

Thin Microsystem

Microvia in upper Cu layer Metal on Si chip Silicon chip

LCP substrate

Lower Cu layer

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Possible applications

The picture shows a possible application as an intelligent plaster

? An ultrathin chip is

embedded in a flexible foil.

? It can be applied e.g. on a

human knee to monitor the bending of the knee and other body parameters.

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