PMT High Voltage Control Board Specification Control ...



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| |LTR. |ECN |DESCRIPTION |DATE |APPROVED |

| |- |NA |Original release |04/01/23 | |

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|SHEET REVISION STATUS |

|SHEET |1 |

|1 | |16 | |ANTARCTIC ASTRONOMY AND ASTROPHYSICS |

|2 | |17 | |RESEARCH INSTITUTE |

|3 | |18 | |THE UNIVERSITY OF WISCONSIN - MADISON, WISCONSIN |

|4 | |19 | |TITLE |

|5 | |20 | |ICECUBE |

|6 | |21 | |PMT HIGH VOLTAGE CONTROL BOARD |

|7 | |22 | |SPECIFICATION CONTROL DRAWING |

|8 | |23 | |ORIGINATOR |DATE |ENGINEER |

|10 | |25 | |LEVEL 2/LEAD |DATE |PRODUCT ASSURANCE |

|12 | |27 | |FILENAME |PROJECT NO. |

|13 | |28 | |9400-0027-SCD.yymmdd.doc |9000 |

|14 | |29 | |DRAWING NO. |SCALE |SIZE |SHEET |

|15 | |30 | |9400-0027-SCD |NA |A |Page 1 of 40 |

Table of Contents

1 INTRODUCTION 5

1.1 Purpose 5

1.2 Scope 5

1.3 Responsibility and Records 5

1.3.1 Document Responsibility 5

1.3.2 Document and Verification Records 5

1.4 Item’s Function in the IceCube System 5

2 APPLICABLE DOCUMENTS 6

2.1 Project Requirements 6

2.2 Reference Documents 6

2.3 Order of Precedence 7

3 REQUIREMENTS 7

3.1 Item Identification 7

3.1.1 Definition 7

3.1.2 Functional Description 7

3.1.3 Functional External Interfaces 8

3.1.4 Schematic Diagram 8

3.2 Performance Requirements 9

3.2.1 Functional Requirements 9

3.2.2 Electrical Requirements 9

3.2.3 Mechanical Requirements 13

3.2.4 External Interface Requirements 15

3.2.5 Environmental Requirements 29

3.2.6 Storage Requirements 30

3.3 Design and Construction Requirements (parts, materials, and processes) 31

3.3.1 Electrical Parts (wire, connectors, solder, insulation, switches, batteries, etc.) 31

3.3.2 Electronic Parts (resistors, capacitors, inductors, semiconductors, tubes, etc.) 31

3.3.3 Mechanical Parts (structures, fasteners, holders, containers, valves, etc.) 32

3.3.4 Coatings, Platings, Corrosion Prevention 32

3.3.5 Adhesives and Sealants 33

3.3.6 Printed Circuit Board 33

3.3.7 Soldering 34

3.3.8 Restricted Parts, Materials and Processes 35

3.3.9 Reliability 35

3.3.10 Interchangeability 35

3.3.11 Manufacturability 35

3.3.12 Workmanship 35

3.3.13 Quality Requirements 35

3.3.14 Safety Requirements 35

3.3.15 Production 35

3.3.16 Installation 35

3.3.17 Documentation/Manuals 35

3.3.18 Personnel and Training 35

4 VERIFICATION 36

4.1.1 Responsibility 36

4.1.2 Special Tests and Examinations 36

4.1.3 Requirement vs. Verification Cross Reference with Section 3 36

5 PREPARATION FOR DELIVERY 36

5.1.1 Identification Nameplates and Marking 36

5.1.2 Part and Serial Numbers 36

5.1.3 Nameplate 36

5.1.4 Cable and Connector ID Tags 36

5.1.5 Acceptance Inspection and Tests 36

5.1.6 Packaging 36

5.1.7 Recording Sensors 36

5.1.8 Crating 36

5.1.9 Labeling 36

5.1.10 Shipping 36

6 DEFINITIONS 37

6.1 IceCube Acronyms 37

6.2 IceCube Glossary 40

7 APPENDIX 40

List of Figures

Figure 3 HV Control Board Envelope 13

Figure 4 HV Control Board PCB Dimensions 14

Figure 5 HV Generator High Voltage Output Lead Wire-Prep requirements shown for (a) coaxial cable, and (b) discrete wire pair. Dimensions in mm. [TBR] 26

Figure 6 HV Control Board Interface Connector Physical Pin Layout 28

Figure 7 Typical HV Generator Module (dimensions in inches) [TBR] 32

List of Tables

Table 1 Voltage and Current Specification for Digital Signals [TBR] 16

Table 2 Timing Specification [TBR] 19

Table 3 Digital Interface Signals Used by the HV Control Board 20

Table 4 Logic Level Input for Power ON/OFF 21

Table 5 Logic Level Input for High Voltage Output ENABLE/DISABLE 22

Table 6 Serial Digital Interface Devices Used by the HV Control Board 22

Table 7 Serial Device Chip-Select Code and Function 23

Table 8 Serial Device Use of Interface Signals 23

Table 9 Ribbon Cable Connector Pin Assignments [TBR] 27

1. INTRODUCTION

1. Purpose

This IceCube Specification Control Drawing (SCD) specifies the performance, fabrication, verification, and production acceptance requirements for the PMT High Voltage Control Board used on the IceCube PMT Modular High Voltage Power Supply.

2. Scope

This Specification Control Drawing shall be applicable to the design, development, integration, verification, production, validation, logistics, field deployment and disposal of the PMT High Voltage Control Board.

3. Responsibility and Records

1. Document Responsibility

The IceCube Project of the Antarctic Astronomy and Astrophysics Research Institute (AAAIR) at the University of Wisconsin – Madison (UW) is responsible for writing and updating these requirements to ensure they are correct, complete and current. UW AAARI Quality Assurance is responsible for ensuring this document and changes to it are properly reviewed, approved and maintained.

2. Document and Verification Records

Records of this document and associated verification and qualification records shall be maintained as follows:

a. The approved and signed original of this document shall be maintained per UW AAARI 9000-0004, Document Management Process.

b. Changes to this document shall be via Engineering Change Notices (ECNs) as described in UW AAARI 9000-0004, Document Management Process.

c. Verification records shall be maintained as described in Section 4 of this document in compliance with UW AAARI 9000-0003, IceCube Quality Plan.

4. Item’s Function in the IceCube System

The IceCube Neutrino Observatory System at the South Pole requires high voltage for one Photomultiplier Tube (PMT) in each of its Digital Optical Module (DOM) sensors. The PMT High Voltage Control Board is one of two subassemblies of the PMT Modular High Voltage (HV) Power Supply. The adjustable-output PMT HV Power Supply creates and supplies approximately 2000 volts maximum anode bias and multiple dynode bias voltages to the PMT inside each DOM sensor. The PMT HV Control Board creates and controls this high voltage in accordance with digital commands from the DOM Main Board. For instance the PMT HV Control Board may adjust its output high voltage to obtain different PMT photon sensitivities. The PMT HV Control Board also measures and reports the value of the output high voltage. The output high voltage is delivered to the PMT HV Base Board where it is applied to the anode for signal extraction and proportionately distributed to the PMT electrodes. There are 5120 Digital Optical Modules in the IceCube system, each containing a PMT HV Control Board in a PMT Modular HV Power Supply. The IceCube system has 4800 DOMs deployed over a kilometer deep in the Antarctic ice with 320 additional DOMs installed on the ice surface, all used for scientific research.

2. APPLICABLE DOCUMENTS

The following documents of the exact issue shown are applicable requirements for this Configuration Item only to the extent they are invoked by specific requirements herein.

1. Project Requirements

a. PMT Modular HV Power Supply Engineering Requirements Document, 9400-0016-ERD

b. PMT HV Generator Source Control Drawing, 9400-0068-SCD, University of Wisconsin-Madison

c. PMT HV Base Board Specification Control Drawing, 9400-0028-SCD

d. PMT HV Power Supply Interface Control Document, 9400-0016-ICD

e. PMT HV Control Board Dimensional and Component Placement Requirements, 5549C037 Rev F, Physical Sciences Lab, University of Wisconsin–Madison

f. PMT HV Control Board Component Envelope Drawing, 5549C104 Rev B, Physical Sciences Lab, University of Wisconsin–Madison

2. Reference Documents

a. JESD8-B, “Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits”, JEDEC Solid State Technology Association, September 1999.

b. IPC-2221, §6.3 Electrical Clearance, “B-4 External Conductors with Permanent Polymer Coating” [TBR]

c. “Book of iButton Standards”, Dallas Semiconductor Corporation, Application Notes Number 937, January, 2002.

3. Order of Precedence

a. Conflicts within this document shall be resolved as directed by the IceCube System Engineer in collaboration with the Project Lead responsible for this Design Item.

b. Conflicts between other documents as they relate to or impact this document shall be resolved as directed by the IceCube Project Manager in collaboration with the IceCube System Engineer.

3. REQUIREMENTS

1. Item Identification

1. Definition

The PMT High Voltage Control Board (HV Control Board) is a printed circuit board (PCB) assembly, containing the High Voltage Generator module, power inputs, control logic, output voltage control, and digital interface circuitry, and, together with the PMT HV Base Board, constitutes the PMT Modular High Voltage Power Supply. The HV Control Board is mechanically mounted as a daughter board to the DOM Flasher Board and is electrically connected to the PMT HV Base Board via a high-voltage cable and to the DOM Main Board via a digital interface cable. No electrical connection, including grounds, is present between the HV Control Board and the DOM Flasher Board.

2. Functional Description

The HV Control Board derives all the power from the DOM Main Board and generates a high voltage in the range of approximately 1000 to 2100 VDC and supplies it to the PMT HV Base Board, where the high voltage potential is divided and distributed to the individual electrodes of the PMT (Error! Reference source not found.). The digital interface circuitry supports the following commands issued by the DOM Main Board:

a. Adjust the HV Generator output voltage

b. Report the measured value of the HV Generator voltage output

c. Report the digital serial number uniquely identifying each individual HV Control Board

d. Respond to power supply power ON/OFF commands

e. Respond to high voltage output ENABLE/DISABLE commands

f. The digital interface circuitry providing the above functions may be either internal or external to the HV Generator either in part or as a whole.

All the power for the HV Generator and the digital interface circuitry is provided by the DOM Main Board.

3. Functional External Interfaces

The HV Control Board has four external functional interfaces:

a. Power input from the DOM Main Board

b. Bidirectional digital control and data from/to the DOM Main Board

c. High voltage output to the PMT HV Base Board

d. Structural mount to the Flasher Board

These interfaces (except for d) are illustrated in Error! Reference source not found..

4. Schematic Diagram

Refer to the IceCube document # 9400-0027-SCH.

[pic]

2. Performance Requirements

1. Functional Requirements

1. High Voltage Generation

The HV Control Board shall generate an adjustable high voltage output for the PMT HV Base Board, using the power provided by the DOM Main Board.

2. Digital Command Response

The HV Control Board shall respond to the following digital control commands issued by the DOM Main Board:

a. ON/OFF command for switching the primary power of the entire HV Control Board

b. ENABLE/DISABLE command for enabling high voltage output

c. Serial DAC code for setting the High Voltage output value

3. Digital Output

The HV Control Board shall provide the following digital output to the DOM Main Board:

a. Serial ADC code for the High Voltage Monitor Output value

b. Serial digital code uniquely identifying the individual HV Control Board

2. Electrical Requirements

1. Input Voltage

1. +5 Volts DC

The HV Control Board shall receive a power input voltage of +5 VDC ±5%.

2. –5 Volts DC

The HV Control Board shall receive a power input voltage of -5 VDC ±5%.

2. Input Current

1. +5 Volts Input Current

The HV Control Board input current for +5 Volt power shall not exceed 70 mA [TBR].

2. –5 Volts Input Current

The HV Control Board input current for -5 Volt power shall not exceed 30 mA [TBR].

3. Input Power

The total input power to the PMT HV Control Board shall not exceed 350 mW [TBR].

4. Internal Grounds

1. Analog Ground

a. The analog signal ground on the HV Control Board shall be referenced by the HV Generator and by the appropriate analog ground pin(s) of the DAC, the ADC, and, if present, the voltage reference device.

b. The shielding case of the HV Generator shall be connected to the analog ground.

c. The analog ground shall be connected to the DOM Main Board interface connector pin(s) designated as DGND at a single point.

2. Digital Ground

Digital Ground and Power Ground shall be one on the PCB and shall refer to the net designated as DGND on the DOM Main Board interface connector.

3. RF Ground

The HV Control Board shall use the Power Ground as the RF ground.

4. Power Ground

Power Ground and Digital Ground shall be one on the PCB and shall refer to the net designated as DGND on the DOM Main Board interface connector.

5. High Voltage Generation

1. HV Adjustment

1. Voltage Adjustment Range

The HV Control Board high voltage output shall be adjustable over a minimum range of 1000 to 2047 VDC when measured using a resistive load of 130 MΩ ± 5%.

2. Minimum Adjustable Voltage

The low-end of the adjustable high voltage range of the HV Control Board shall be greater than –5 VDC when measured using a resistive load of 130 MΩ ± 5%.

3. Maximum Adjustable Voltage

The high-end of the adjustable high voltage range of the HV Control Board shall be less than 2100 VDC when measured using a resistive load of 130 MΩ ± 5%.

4. Voltage Adjustment Resolution

The HV Control Board shall use a 12-bit resolution DAC for digitally setting the value of the high voltage output.

5. Voltage Adjustment Linearity

The HV Control Board high voltage output and the corresponding digital command code shall have a linear relationship over the specified adjustment voltage range with a slope of 0.5 Volts ± [TBD] Volts per bit when measured using a resistive load of 130 MΩ ± 5%.

2. High Voltage Quality

1. Voltage Stability (Absolute bound around set point)

a. The high voltage output of the HV Control Board shall not deviate from the set point by more than 0.2% over any eight-hour period, once the output value has reached within this range of the set point, under a stable operating temperature.

b. The high voltage output of the HV Control Board shall not change from the set point at a rate any faster than 0.2% per hour.

2. Voltage Ripple (Noise)

The HV Control Board high voltage output ripple voltage, originating from the HV Generator, shall be less than 5 mVpp when measured with a resistive load of 130 MΩ ± 5%.

Note: Laboratory measurements show that far greater ripple amplitudes are acceptable in order to meet the requirement for the PMT Modular HV Power Supply, which specifies the ripples to be less than 0.5mVpp when measured at the end of the resistively-terminated pulse-output cable.

6. High Voltage Monitoring

1. Voltage Monitoring Output

The HV Control Board shall allow monitoring of the high voltage output using an ADC and transmit its value to the DOM Main Board as a digital code upon command.

2. Voltage Monitoring ADC Resolution

The HV Control Board shall use a 12-bit resolution ADC for monitoring the value of the high voltage output.

3. Voltage Monitoring Linearity

The HV Control Board high voltage output being monitored and the corresponding digital value shall have a linear relationship in the specified adjustment voltage range with a slope of 0.5 V ± [TBD] Volts per bit when measured using a resistive load of 130 MΩ ± 5%.

4. Voltage Monitoring Accuracy

The HV Control Board high voltage output value that is digitally reported shall be within ±2% [TBR] of the true value.

Note: The value is based on a prototype evaluation.

7. Current Sourcing Capability

1. Current Sourcing at Minimum Operating Temperature

The HV Control Board shall provide a DC current sourcing capability of a minimum of 12 nA at the minimum operating temperature specified herein, as determined by the output voltage changing less than 10V when the current is varied from zero to the specified minimum current.

2. Current Sourcing at Maximum Operating Temperature

The HV Control Board shall provide a DC current sourcing capability of a minimum of 240 nA at the maximum operating temperature specified herein, as determined by the output voltage changing less than 10V when the current is varied from zero to the specified minimum current.

3. Pulsed Current Sourcing

The HV Control Board shall provide a current sourcing capability of a minimum of 60 mA for a single 1 μsec square-pulse, at the minimum operating temperature specified herein, as determined by the output voltage changing less than 10V when the current is changed from zero to the specified pulse current during the pulse time. [TBR]

Note: Sixty percent of the total requirement for the PMT Modular HV Power Supply is being allocated to the HV Control Board. Since the PMT HV Base Board with the required 4.7 nF-capacitor across the input is capable of sourcing 47% of the required current, the present requirement assures a 7% margin for meeting the requirement for the PMT Modular HV Power Supply.

3. Mechanical Requirements

1. Overall Size and Volume Constraints

a. The maximum height of the components on the bottom side of the HV Control Board shall be no greater than 16 mm.

b. The maximum height of the components on the top side of the HV Control Board shall be 22 mm minus the printed circuit board thickness (1.6mm typical).

c. All the components on the HV Control Board shall be wholly contained within the component envelope, defined in Figure 2, except for:

• Interface ribbon cable

• HV output cable

• Stand-offs for mounting the HV Control Board to the next higher assembly.

d. The lateral extent of the HV Control Board, defined by the “Component Side View” in Figure 2, shall be as specified in the next section.

[pic]

Figure 2 HV Control Board Envelope

2. PCB Dimensions

The overall shape of the printed circuit board of the PMT HV Control Board shall be as shown in Figure 3, where the dimensions are for the maximum extent of the board outline, corresponding to the “Component Side View” in Figure 2.

a. The maximum board outline dimensions shall be observed to within ±0.5 mm.

b. The relative locations of the three mounting holes shall be observed to within ±0.1 mm.

c. The ribbon connector mounting location, relative to the mounting holes, shall be observed to within ±1 mm

[pic]

Figure 3 HV Control Board PCB Dimensions

3. Weight

The fully assembled HV Control Board shall weigh no greater than 100 grams [TBR].

4. External Interface Requirements

1. Electric Power

The HV Control Board shall receive all of its electric power from the DOM Main Board through the conductors in the DOM Main Board-to-HV Control Board interface cable.

2. Grounding

1. Digital Signal Grounding

External Digital Signal Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

2. RF Signal Grounding – Provisions for EMI Suppression

External RFI and EMIC Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board. There shall be provisions on the PMT HV Control Board for connecting a 9 mm flat insulated braided wire between the HV Control Board ground foil and the HV Base Board ground foil.

3. Power Grounding

Power Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

4. High Energy Grounding

External High Energy Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

5. Safety Grounding

External Safety Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

3. Analog Signals

The HV Control Board shall have a single analog high-voltage output, defined in Section 3.2.1.

4. Digital Signals

1. Voltage, Current and Timing

1. Applicable Standard(s)

The logic levels and corresponding voltages between the HV Control Board and the DOM Main Board communications shall comply with the specifications in JESD8-B, “Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits”, JEDEC Solid State Technology Association, September 1999.

2. Voltage and Current Specification [TBR]

3. The voltage and current specifications for the digital communication between the HV Control Board and the DOM Main Board shall be as shown in Table 1.

4. Table 1 Voltage and Current Specification for Digital Signals

|Parameter |Min. |Max. |Units |

|Voltage output from HV |Logic “High” |2 |3.3 |V |

|Control Board | | | | |

| |Logic “Low” |-0.3 |0.8 |V |

|Voltage input to HV Control |Logic “High” |2.4 |3.6 |V |

|Board | | | | |

| |Logic “Low” |0 |0.4 |V |

|Current out of HV Control | |- |10 |μA |

|Board | | | | |

|Current into HV Control Board| |- |2 |mA |

5. Note 1: The device on the DOM Main Board with which the HV Control Board communicates is a Xilinx CoolRunner II operating with a 3.3V I/O voltage. The device is capable of driving a 3.3V LVTTL input as well (i.e., it can source more than 2 mA into an LVTTL input.)

6. Note 2: The following table summarizes the specifications of JESD8-B, assuming the I/O supply for the CoolRunner II varies over 3.0V to 3.6V and the HV Control Board input sinks a maximum of 2 mA.

7. Note 3: The voltage and current specifications do not apply to the IDENT signal. For the IDENT signal, the requirements specific to the Dallas 1-Wire protocol shall apply.

8.

9. Timing Specification [TBR]

10. The digital interface devices on the HV Control Board shall meet the timing specification in Table 2 in sending and receiving digital signals.

11. Table 2 Timing Specification

|Clock frequency |0.1 - 1 MHz |

|Clock duty ratio |20 – 80 % |

|Rise Time for all logic and clock |0.3 - 9.0 ns |

|Fall Time for all logic and clock |0.8 – 10.5 ns |

12. Note 1: The timing specification here does not apply to the IDENT signal. The IDENT device operation relies on its unique timing requirements.

13. Note 2: The rise time / fall time values are from “Cool Runner-II I/O Characteristics”, Xilinx Document No. XAPP382 (v 1.0), November 11, 2002. The value ranges correspond to the load capacitance range of 0 to 100 pF.

14. Note 3: JESD8-B does not specify timing. A possibly applicable standard for the timing is JEDEC Document No. 13-B, “Standard Specification for Description of ‘B’ Series CMOS Devices”, May 1980; however, the Xilinx datasheet (Note 2) is probably more up-to-date and suites better for the present purpose.

15.

2. Digital Communication

3. Connection Medium

The HV Control Board external digital signals shall be carried by an IDC ribbon cable to and from the DOM Main Board as specified herein.

1. Signal Identification

The HV Control Board shall communicate with the DOM Main Board using the digital interface signals identified in Table 3. Input to the HV Control Board shall be defined to be the “IN” direction.

Table 3 Digital Interface Signals Used by the HV Control Board

|Signal Name |Direction |Description |

|POWER_ON |IN |Board power on/off |

|HV_DISABLE |IN |HV output enable/disable |

|CS0 |IN |Chip-select bit 0 |

|CS1 |IN |Chip-select bit 1 |

|SCLK |IN |Serial clock |

|MISO |OUT |Master-In-Slave-Out serial data |

|MOSI |IN |Master-Out-Slave-In serial data |

4. High Voltage Power Supply ON/OFF

1. High Voltage Power Supply ON/OFF Control

The HV Control Board shall perform ON/OFF switching of the input power of the PMT Modular HV Power Supply in response to a logic level command sent by the DOM Main Board as a discrete signal.

2. High Voltage Power Supply ON/OFF Signal Logic Level

The HV Control Board input signal logic level assignment for power ON/OFF control shall be as shown in Table 4 Logic Level Input for Power ON/OFF.

Table 4 Logic Level Input for Power ON/OFF

|Logic Level |Function |

|0 |POWER OFF |

|1 |POWER ON |

5. High Voltage Output Enable/Disable

1. High Voltage Output Enable/Disable Control

The HV Control Board shall perform ENABLE/DISABLE control switching of high voltage output in response to a logic level command sent by the DOM Main Board as a discrete signal.

2. High Voltage Output ENABLE/DISABLE Signal Logic Level

The HV Control Board input signal logic level assignment for HV ENABLE/DISABLE control shall be as shown in Table 5 Logic Level Input for High Voltage Output ENABLE/DISABLE.

Table 5 Logic Level Input for High Voltage Output ENABLE/DISABLE

|Logic Level |Function |

|0 |ENABLE HV OUTPUT |

|1 |DISABLE HV OUTPUT |

6. Serial Interface Digital Devices

The HV Control Board shall use the serial digital interface devices listed in Table 6.

Table 6 Serial Digital Interface Devices Used by the HV Control Board

|Device |Function |Part number |

|IDENT |Board serial number |Dallas Semiconductor (Maxim) DS2401 or equivalent |

|DAC |HV output adjustment |Linear Technology LTC1257IS8 or equivalent |

|ADC |HV output monitor |Linear Technology LTC1286IS8 or equivalent |

7. Chip Select

1. Chip Select Signals (CS0, CS1)

The HV Control Board shall use the two chip-select signals, CS0 and CS1, in combination to select one of the three serial digital devices listed in Table 6.

2. Chip Select Codes

The HV Control Board shall recognize the logic level of the chip-select signals, CS0 and CS1, to exclusively select one device at a time as assigned in Table 7.

Table 7 Serial Device Chip-Select Code and Function

|CS0 |CS1 |Selected Device |Function |

|1 |1 |IDENT |Board Serial Number |

|0 |1 |DAC |HV Output Adjustment |

|1 |0 |ADC |HV Output Monitor |

|0 |0 |(not allowed) |None |

8. Device Use of Serial Interface Signals -- MISO, MOSI, and SCLK

The serial interface devices used on the HV Control Board shall use the data and clock interface signals as shown in Table 8.

1. Multiplexing MISO for IDENT and ADC Data

The operation of the IDENT device requires the signal on the MISO line to have a rate of logic transitions in the range specified in the Dallas 1-Wire signaling protocol. The device for multiplexing MISO for IDENT and ADC data must, therefore, support both the normal CMOS transitions and the slow 1-Wire signaling transitions. The use of an analog switch, rather than a logic multiplexer, as shown Error! Reference source not found. in will accomplish such a requirement.

Table 8 Serial Device Use of Interface Signals

|Device |MISO |MOSI |SCLK |Function |

|IDENT |data | | |Board serial number |

|DAC | |data |clock |HV output adjustment |

|ADC |data | |clock |HV output monitor |

9. Board Identification

1. Pull-up Resistor

The HV Control board shall provide a 5kΩ pull-up resistor (closest value in 5% or better) to +3.3VDC (relative to DGND) for the IDENT device serial signal line.

2. IDENT Device Operation

The IDENT device shall communicate with the DOM Main Board that serves as the bus master according to the protocol specified in the Dallas 1-Wire signaling scheme. [reference document in Section 2]

10. HV Output Adjustment

1. DAC Digital Command Code

The digital command code received by the HV Control Board DAC used for setting the HV output value shall be in 12-bit unsigned straight binary with the digital value 000 (hex) representing 0 Volts DC.

2. DAC Device Operation

[TBD]

Note: Refer to the LTC1257 datasheet.

11. HV Output Monitor

1. ADC Digital Output Code

The digital output code transmitted by the HV Control Board ADC used for monitoring the HV output shall be in 12-bit unsigned straight binary with the digital value 000 (hex) representing 0 Volt DC.

2. ADC Device Operation

[TBD]

Note: Refer to the LTC1286 datasheet

5. Interconnections

1. Cables and Harnesses – HV Control Board and HV Base Board

1. High Voltage Cable Interface Medium

The high voltage output cable or wires shall consist of two parallel, twisted, or coaxial conductors, one having the high voltage potential with respect to the HV Control Board Power Ground, and the other being the high voltage return that is referenced to the same ground.

2. High Voltage Cable/Wire Termination

The high voltage cable or wires shall be electrically and mechanically terminated inside the High Voltage Generator module.

3. High Voltage Cable/Wire Connection Mechanical Integrity

The high voltage cable or wires shall not degrade when the cable or wires are pulled with a maximum of 5 kg of force in any direction from the surface of the HV Control Board. [TBR]

4. High Voltage Output Cable/Wire Length

The high voltage output cable or wires shall be a pigtail 100 ± 3 mm [TBR] long measured from the top surface of the HV Control Board PCB. This length does not include the portion where the insulation has been stripped, according to 3.2.4.5.1.8.

5. High Voltage Cable/Wire Voltage Rating

The high voltage cable or wires shall be rated at 2500 VDC or RMS minimum breakdown over all the operational environments and operational life specified herein.

6. High Voltage Cable/Wire Construction

The high voltage wire shall have flexible copper conductors with either silicon rubber or PTFE insulation.

7. High Voltage Cable/Wire Bending Radius

The high voltage cable or wire shall have a minimum bending radius of less than 12.7 mm over all the operational environments and operational life specified herein. (Particular design attention should be paid to cold flow properties during long term undisturbed bending.)

8. High Voltage Output Cable/Wire Pigtail Wire-Prep

The high voltage cable or wires shall be stripped and tinned as shown below.

[pic]

Figure 4 HV Generator High Voltage Output Lead Wire-Prep requirements shown for (a) coaxial cable, and (b) discrete wire pair. Dimensions in mm. [TBR]

2. Cables and Harnesses – HV Control Board and DOM Main Board

1. Cable Interface Medium

The HV Control Board shall have all electrical connections with the DOM Main Board through a single multi-conductor ribbon cable for power, ground, and digital signals.

2. Signal Conductor Redundancy

Each signal, ground and power interface in the PMT Modular High Voltage Power Supply HV Control Board to DOM Main Board cable shall have two conductors allocated to it for redundancy.

3. Cable Type

The HV Control Board to DOM Main Board cable shall be a 1 mm pitch flat IDC ribbon cable with 28 AWG (stranded, 7/36) [0.320 mm total, 7 strands of 0.127 mm wire].

Note: The ribbon cable/connector assembly is a Samtec custom P/N ASP-109692-01, documented in the IceCube drawing #9400-0022-DWG.

3. Connectors

1. HV Control Board to DOM Main Board Connector Type

The PMT Modular High Voltage Power Supply ribbon connector shall have a 2mm-pitch male connector, Samtec STMM-110-02-S-D.

2. Connector Locations

See drawing, PMT HV Control Board Dimensional and Component Placement Requirements, 5549C037 Rev F, Physical Sciences Lab, University of Wisconsin–Madison (Figure 3) for the suggested locations for cables and connectors attachment requirements. [TBR]

4. Pinouts

1. Ribbon Cable Connector Pin Assignments

Pin assignments for the ribbon cable between the HV Control Board and the DOM Main Board are shown in the table below. For increased reliability each signal, ground return and power conductor in the PMT Modular High Voltage Power Supply to DOM Main Board cable shall have a minimum of two redundant pins allocated as shown.

Table 9 Ribbon Cable Connector Pin Assignments [TBR]

|Pin # |Signal Name |Description |

|01 |DGND |Digital and power ground |

|02 |SCLK |Serial clock |

|03 |SCLK |Serial clock |

|04 |MOSI |Master-out-slave-in |

|05 |MOSI |Master-out-slave-in |

|06 |MISO |Master-in-slave-out |

|07 |MISO |Master-in-slave-out |

|08 |DGND |Digital and power ground |

|09 |CS0 |Chip-select bit 0 |

|10 |CS0 |Chip-select bit 0 |

|11 |CS1 |Chip-select bit1 |

|12 |CS1 |Chip-select bit1 |

|13 |ON/OFF |Board enable/disable |

|14 |ON/OFF |Board enable/disable |

|15 |+5V |Main power (+) |

|16 |+5V |Main power (+) |

|17 |DGND |Digital and power ground |

|18 |DGND |Digital and power ground |

|19 | | |

|20 | | |

|21 | | |

|22 | | |

|23 | | |

|24 | | |

2. Connector Physical Pin Layout

The HV Control Board external interface connector shall have the pin layout in Figure 5.

[pic]

Figure 5 HV Control Board Interface Connector Physical Pin Layout

6. Grasping/Mounting Points

1. Mounting Provisions for Next Higher Assembly

The HV Control Board shall provide holes and clearances for mounting it to the DOM Flasher Board using stainless-steel hexagonal stand-offs. The clearance zones shall be concentric with the mounting holes and have a minimum diameter of 9.5 mm. There shall be no copper foil within this diameter.

2. Mounting Locations

The HV Control Board mounting locations for installation into the next higher assembly shall be as shown in Figure 3.

7. Test and Maintenance

1. Test Points

Voltage measurement test points shall be provided for measuring all input voltages to the HV Control Board and the input voltages to the High Voltage Generator.

There shall be no need for removal or relocation of any parts for access to the test points.

5. Environmental Requirements

1. Temperature

1. Operating Temperature

The HV Control Board shall meet all performance requirements when operating over an ambient temperature range of –40 °C to +27 °C.

2. Non-Operating Temperature

The HV Control Board shall withstand a non-operating temperature range of [TBD] °C to [TBD] °C for a period up to [TBD] months without any degradation in performance.

3. Storage/Transport Temperature

The HV Control Board shall withstand a storage and transport temperature range of –55 °C to +45 °C for a period of [TBD] months without any degradation in performance.

2. Thermal Shock

Shall be consistent with the DOM-level requirements.

3. Pressure

1. Operating Pressure

The HV Control Board shall meet all performance requirements while operating at 1 atmosphere in air or while operating inside a pressure vessel with a sustained internal Nitrogen gas atmospheric pressure of 40,000 Pa to 100,000 Pa.

2. Non-Operating and Storage/Transport Pressure

Shall be consistent with the DOM-level requirements.

4. Mechanical Shock and Vibration

Shall be consistent with the DOM-level requirements.

5. Electromagnetic Interference/Compatibility

Shall be consistent with the DOM-level requirements.

6. Humidity

Shall be consistent with the DOM-level requirements.

7. Radioactivity

Shall be consistent with the DOM-level requirements.

6. Storage Requirements

[TBD]

3. Design and Construction Requirements (parts, materials, and processes)

1. Electrical Parts (wire, connectors, solder, insulation, switches, batteries, etc.)

To the extent practical, all electrical components used for the PMT High Voltage Control Board shall meet the lowest operating temperature of –55(C, as specified by the component manufacturer. “Practical” means that this requirement applies to all PCB material; conformal coating; and any electrical components that are readily available for the operating temperature of –55(C or lower.

The vendor of the PMT High Voltage Control Board shall supply IceCube with a list of electrical components used that do not meet the –55(C or lower operating temperature.

2. Electronic Parts (resistors, capacitors, inductors, semiconductors, tubes, etc.)

To the extent practical, all electronic components used for the PMT HV Control Board shall meet the lowest operating temperature of –55(C, as specified by the component manufacturer. “Practical” means that this requirement applies to all resistors, capacitors and diodes and any other electronic components that are readily available for the operating temperature of –55(C or lower.

The vendor of the PMT High Voltage Control Board shall supply IceCube with a list of electronic components used that do not meet the –55(C or lower operating temperature.

1. High Voltage Generator

The High Voltage Generator Source Control Drawing 9400-0068-SCD , shall be a self-contained metal shielded potted module requiring only input power and control signals to deliver high voltage via a pigtail output lead(s). It shall be designed with wire leads for direct solder to the HV Control Board with its insulated high voltage output lead(s) long enough to reach the HV Base Board when mounted in a DOM. The part shall be similar to Figure 6.

[pic]

Figure 6 Typical HV Generator Module (dimensions in inches) [TBR]

3. Mechanical Parts (structures, fasteners, holders, containers, valves, etc.)

4. Coatings, Platings, and Corrosion Prevention

1. Conformal Coating by Supplier

No conformal coating shall be applied to the HV Control Board by the supplier.

2. Conformal Coating Prior to Installation at Next Higher Assembly

[TBD]

5. Adhesives and Sealants

[TBD]

6. Printed Circuit Board

1. Top and Bottom Side Definitions

The “bottom side” of the HV Control Board shall refer to the side of the PCB closest to the Flasher Board when mounted to the Flasher Board. The “top side” of the board shall refer to the side opposite to the bottom side. The terms “bottom view” and “top view” shall refer to the views from the bottom side and top side of the boards, respectively.

Note: The “ice top view” is a view of the Digital Optical Module components in ice seen from the ice surface. For the purpose of the HV Control Board, the “ice top view” and the “top view” are synonymous.

2. Printed Circuit Board Material

The PMT HV Control Board PCB dielectric board material shall be FR-4 with a nominal thickness of 1.6mm (1/16 inches) [TBR].

3. Printed Circuit Board Copper

The PMT HV Control Board PCB shall use the copper foil thickness of 1 oz/ ft2 [TBR] for electrical traces and solder pads.

4. Component Placement

1. Top or Bottom Side Placement

The components may be placed on either the top side or the bottom side of the PCB within the constraints of the component envelope, except for the following items:

a. Ribbon cable connector (Top Side)

b. High Voltage Generator (Bottom side)

c. High Voltage Cable/Wire exit point (Top side)

d. RF grounding connection wire pad (Top side)

2. Accessibility Placement

The following items shall be installed at locations where engineers can easily access for measuring or modification after the HV Control Board has been mounted on the Flasher Board:

a. Test Points

b. RF grounding connection wire pad

5. Minimum Trace Spacing Requirements

In compliance with the circuit board trace layout rules specified in JESD8-B, “Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits”, JEDEC Solid State Technology Association, September 1999.

IPC-2221, §6.3 Electrical Clearance, “B-4 External Conductors with Permanent Polymer Coating” [TBR], the following conditions shall be met for both DC voltages and AC peak voltages:

a. For voltage difference greater than 100 V and less than 300 V, the minimum trace spacing shall be 0.4 mm.

b. For voltage difference greater than 300 V and less than 500 V, the minimum trace spacing shall be 0.8 mm.

c. For voltage difference greater than 500 V, the minimum trace spacing shall be 0.8 mm plus 0.00305 mm per every volt exceeding 500 V.

7. Soldering

1. Manual Soldering Compatibility

The PCB shall be compatible with the increased temperature during the installation of the HV Generator to the HV Control Board PCB by manual soldering.

2. Solder Mask

A solder mask shall be applied to both the top and bottom sides of the Printed Circuit Board (PCB) with masked clearance including, but not limited to, the following items:

a. All solder pads

b. Through holes for component pins and leads

c. Test points

d. Designated clear solder pad areas for jumpers, grounding wire, etc.

3. Silk Screen Marking

a. Silk screen markings shall include, but not be limited to, the following items:

b. Supplier identifier

c. IceCube Project identifier

d. Part number and revision number

e. Component reference designators

f. Connector reference designators with pin 1 and the highest pin number marked

g. Test points

h. HV Generator pin numbers

8. Restricted Parts, Materials and Processes

Shall be consistent with the DOM-level requirements.

9. Reliability

10. Interchangeability

11. Manufacturability

12. Workmanship

13. Quality Requirements

14. Safety Requirements

15. Production

16. Installation

17. Documentation/Manuals

DOM assembly procedure

18. Personnel and Training

4. VERIFICATION

1. Responsibility

2. Special Tests and Examinations

3. Requirement vs. Verification Cross Reference with Section 3

5. PREPARATION FOR DELIVERY

1. Identification Nameplates and Marking

2. Part and Serial Numbers

The HV Control Board shall be indelibly and legibly marked with part number, revision, serial number and manufacture date code.

3. Nameplate

4. Cable and Connector ID Tags

5. Acceptance Inspection and Tests

The supplier shall perform and record In-process and Final Acceptance Inspection and Tests on each PMT HV Control Board using pass/fail criteria to a level adequate to demonstrate that the item was fabricated with the correct materials and processes and the item properly functions at limit and nominal electrical inputs at standard temperature and pressure.

6. Packaging

7. Recording Sensors

8. Crating

9. Labeling

10. Shipping

6. DEFINITIONS

1. IceCube Acronyms

|ADC |Analog-to-Digital Converter |

|ATWD |Analog Transient Waveform Digitizer |

|AWG |American Wire Gauge |

|Cm |Centimeter |

|CMOS |Complementary Metal Oxide Semiconductor |

|CS0 |Chip-select bit 1 |

|CS1 |Chip-select bit 0 |

|DAC |Digital-to-Analog Converter |

|DAQ |Data Acquisition System |

|DC |Direct Current |

|DOM |Digital Optical Module |

|DOMMB |Digital Optical Module Main Board |

|EM |Electromagnetic |

|EMC |Electromagnetic Compatibility |

|ERD |Engineering Requirements Document |

|HV |High Voltage |

|Hz |Hertz |

|ID |Inside Diameter |

|IDC |Insulation Displacement Connector |

|IPC |Institute for Interconnecting and Packaging Electronic Circuits |

|K |Kilo (103) |

|Kg |Kilogram |

|LED |Light-Emitting Diode |

|MKS |Meter-kilogram-second |

|M |Mega (106) |

|M |Meter |

|mA |Milliampere |

|MOSI |Master-Out-Slave-In |

|MISO |Master-In-Slave-Out |

|mV |Millivolt |

|mW |Milliwatt |

|n |Nano (10-9) |

|OD |Outside Diameter |

|OM |Optical Module |

|P |Pico (10-12) |

|Pa |Pascal |

|PCB |Printed Circuit Board |

|PE |Photoelectron |

|pF |Pico Farad |

|PMT |Photomultiplier Tube |

|P/N |Part Number |

|PSL |Physical Sciences Laboratory, University of Wisconsin-Madison |

|P/V ratio |Peak-to-valley ratio |

|s, sec |Second |

|SCLK |Serial Clock |

|SI |Système International d’Unités |

|SMB |Sub-Miniature B |

|SPE |Single Photoelectron |

| | |

|TBD |To Be Determined |

|TBR |To Be Reviewed |

|UL |Underwriters Laboratory |

|V |Volt |

|VDC |Volt DC |

|W |Watt |

2. IceCube Glossary

|Anode |A PMT dynode, the last in the multiplier chain and typically larger than the preceding dynodes, |

| |that collects the final charge pulse. |

|Cathode |The active surface of the photomultiplier from which photoelectrons are initially liberated. |

|Zero |The temperature, in degrees Celsius, at which water changes state from a liquid into a solid. |

7. APPENDIX

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Figure 1 Functional Block Diagram.

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