HD3SS3411 One Channel Differential 2:1 Mux/Demux datasheet

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HD3SS3411

SLASEB6 ? NOVEMBER 2015

HD3SS3411 One Channel Differential 2:1 Mux/Demux

1 Features

?1 Compatible with Multiple Interface Standards Including FPD Link, LVDS, PCIE Gen II, III, XAUI, and USB3.1

? Operates up to 10 Gbps ? Wide ?3 dB Differential BW of ~ 7.5 GHz ? Excellent Dynamic Characteristics (at 4 GHz)

? Insertion Loss = -1.1 dB ? Return Loss = -11.3 dB ? Off Isolation = ?19 dB ? Bidirectional "Mux/De-Mux" Differential Switch ? Supports Common Mode Voltage 0 V to 2 V ? Single Supply Voltage VCC of 3.3 V ?10% ? Industrial Temperature Range of -40?C to 105?C

2 Applications

? Industrial Data Switching ? Desktop and Notebook PCs ? Server/Storage Area Networks ? PCI Express Backplanes ? Shared I/O Ports

3 Description

The HD3SS3411 is a high-speed bi-directional passive switch in multiplexer or demultiplexer configurations. Based on control pin SEL, the device provides switching of differential channels between Port B to Port A or Port C to Port A.

The HD3SS3411 is a generic analog differential passive switch that can work for any high speed interface application as long as it is biased at a common mode voltage range of 0 V to 2 V and has differential signaling with differential amplitude up to 1800 mVpp. The device employs adaptive tracking that ensures the channel remains unchanged for entire common mode voltage range.

Excellent dynamic characteristics of the device allow high speed switching with minimum attenuation to the signal eye diagram with little added jitter. It consumes < 2 mW of power when operational and has a shutdown mode exercisable by OEn pin resulting < 2 ?W.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

HD3SS3411 HD3SS3411I

WQFN (14)

3.50 mm x 3.50 mm

(1) For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic VCC

Bp Bn Ap An Cp Cn

SEL GND

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

HD3SS3411

SLASEB6 ? NOVEMBER 2015



Table of Contents

1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics........................................... 5 6.6 Timing Requirements ................................................ 5 6.7 Typical Characteristics .............................................. 6 7 Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 7 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 8

8 Application Information and Implementation ..... 9 8.1 Application Information.............................................. 9 8.2 Typical Application .................................................... 9 8.3 Design Requirements.............................................. 10 8.4 Detailed Design Procedure ..................................... 10 8.5 Application Curves .................................................. 12

9 Power Supply Recommendations...................... 12 10 Layout................................................................... 13

10.1 Layout Guidelines ................................................. 13 10.2 Layout Example .................................................... 14 11 Device and Documentation Support ................. 15 11.1 Documentation Support ....................................... 15 11.2 Community Resources.......................................... 15 11.3 Trademarks ........................................................... 15 11.4 Electrostatic Discharge Caution ............................ 15 11.5 Glossary ................................................................ 15 12 Mechanical, Packaging, and Orderable Information ........................................................... 15

4 Revision History

DATE November 2015

REVISION *

NOTES Initial release.

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5 Pin Configuration and Functions

RWA Package 14 Pin (WQFN)

Top View

OEn

GND

1

14

NAME Ap An Bp Bn Cp Cn GND

OEn

RSVD

SEL

VCC

NO 2 3 13 12 10 9 5,8,11,14, Pad

1

6

7

4

Ap 2 An 3 VCC 4 GND 5 RSVD 6

13 Bp 12 Bn 11 GND 10 Cp 9 Cn

TYPE I/O I/O I/O I/O I/O I/O G

I

I/O

I

P

7

8

SEL

GND

Pin Functions

Port A, High Speed Positive Signal Port A, High Speed Negative Signal Port B, High Speed Positive Signal Port B, High Speed Negative Signal Port C, High Speed Positive Signal Port C, High Speed Negative Signal

DESCRIPTION

Ground

Active Low Chip Enable L: Normal operation H: Shutdown

Reserved Pin ? connect or pull-down to GND

Port select pin L: Port A to Port B H: Port A to Port C

3.3 V power

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6 Specifications

6.1 Absolute Maximum Ratings(1)

Over operating free-air temperature range (unless otherwise noted)

Supply voltage range (VCC) Voltage range

Absolute minimum/maximum supply voltage range Differential I/O Control pin

MIN

MAX

UNIT

?0.5

4

V

?0.5 ?0.5

2.5 V

VDD + 0.5

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

V(ESD) Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1) Charged-device model (CDM), per AEC Q100-011

VALUE ?2000 ?500

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

UNIT V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

VCC

Supply voltage

VIH

Input high voltage (SEL, OEn Pin)

VIL

Input low voltage (SEL OEn Pin)

VDiff

High speed signal pins differential voltage

VCM

Common mode voltage (differential pins)

TA

Operating free-air temperature

MIN 3 2

?0.1 0 0

?40

NOM

MAX 3.6 VCC 0.8 1.8 2 105

UNIT V V V VPP V ?C

6.4 Thermal Information

THERMAL METRIC(1)

HD3SS3411 RWA (WQFN)

UNIT

14 PINS

RJA RJC(top) RJB JT JB RJC(bot)

Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter Junction-to-case (bottom) thermal resistance

50.5 63.1 26.4

?C/W 2.2 26.5 7.3

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

ICC ISTDN CON

Device active Current Device shutdown Current Outputs ON Capacitance

RON

Output ON resistance

RON

On resistance match between pairs of the same channel

R(FLAT_ON) IIH(CTRL)

On resistance flatness (RON(MAX) ? RON(MAIN)

Input high current, control pins (SEL, OEn)

VCC = 3.3 V, OEn = 0 VCC = 3.3 V, OEn = 0

VCC = 3.3 V; VCM = 0 V to 2 V ; IO = ?8 mA VCC = 3.3 V ; ?0.35 V VIN 2.35 V; IO = ?8 mA

VDD = 3.3 V; ?0.35 V VIN 2.35 V

IIL(CTRL)

Input low current, control pins (SEL, OEn)

IIH(HS)

Input high current, high speed pins

[A/B/C][p/n] VIN = 2 V for selected port, A and B with SEL= 0, and A and C with SEL = VCC

[A/B/C][p/n] VIN = 2 V for non-selected port, C with SEL= 0, and B with SEL = VCC (Note there is a 20 K pull-down in nonselected port)

IIL(HS)

Input low current, high speed pins

High Speed Performance

[A/B/C][p/n]

f = 0.3 MHz

IL

Differential Insertion Loss

f = 2.5 GHz f = 4 GHz

BW

-3 dB Bandwidth

f = 0.3 MHz

RL

Differential return loss

f = 2.5 GHz f = 4 GHz

f = 0.3 MHz

OI

Differential OFF isolation

f = 2.5 GHz f = 4 GHz

Xtalk

Differential Crosstalk

f = 4 GHz

6.6 Timing Requirements

MIN

tPD tSW tSK_INTRA

Switch propagation delay Switching time Intra-pair output skew

HD3SS3411

SLASEB6 ? NOVEMBER 2015

MIN TYP 0.6 0.3 0.6

5

MAX 0.8 0.6

8

UNITS mA ?A pF

0.5

1

1

?A

1

?A

1

?A

100

?0.5 ?0.7 ?1.1

7.5 ?26.4 ?16.6 ?11.3

?75 ?22 ?19 ?35

140

?A

1

?A

dB GHz dB

dB dB

NOM

MAX 80 0.5 5

UNIT ps ns ps

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