Doc.: IEEE 802.11-20/1092r0



IEEE P802.11Wireless LANsWLAN Sensing SG – July 2020 Plenary Meeting MinutesDate: 2020-07-16Author(s):NameAffiliationAddressPhoneemailClaudio da SilvaIntelclaudio.da.silva@Tony Xiao HanHuawei Technologies Co., Ltdtony.hanxiao@-62865205740AbstractThis document contains the meeting minutes of the two IEEE 802.11 Study Group on WLAN Sensing (SENS SG) sessions held in the July 2020 plenary meeting.00AbstractThis document contains the meeting minutes of the two IEEE 802.11 Study Group on WLAN Sensing (SENS SG) sessions held in the July 2020 plenary meeting.Teleconference on July 14th, 2020The IEEE 802.11 SENS SG teleconference was called to order at 10:02am ET by the Chair (Tony Xiao Han, Huawei).Attendance log can be found in Appendix 1.The agenda for the meeting can be found in IEEE 802.11-20/0996r2.Guidelines on “Meeting Protocol, Attendance, Voting & Document Status” (slide 4) were reviewed. No items noted.Patent policy guidelines (slides 6-9) were reviewed. No items noted.Guidelines on the IEEE Codes of Ethics & Conduct, "individual process," and "fair & equitable consideration" (slides 10-12) were reviewed. Required notices (slide 13) were also reviewed. No items noted.The proposed agenda (slide 15) was reviewed and approved without objection.Motion “Move to approve SENS SG minutes of meetings and teleconferences from January 2020 meeting to today:January F2F meeting: Feb-March: April-May: Jun-July: ”Move: Claudio da Silva (Intel)Second: Edward Au (Huawei)Discussion: No discussion.Result: Approved with unanimous consent.Chair reviewed the call for contributions (slide 16), SENS SG timeline (slides 17 and 18), and future teleconference times (slide 19) slides.Discussion of the SENS SG PAR and CSD by Claudio da Silva (Intel).Presenter presented to the group a new revision of the PAR, 19/2103r11, which incorporates the changes proposed in 20/0989r1.Presenter presented to the group that a new revision of the CSD, 20/0042r6, which reflects changes made to the PAR (19/2103r11).The following straw poll was conducted: “Should the proposed PAR found in 19/2103r11 be accepted as the SENS SG PAR?” Results: Yes: 66, No: 1, Abstain: 22.The following straw poll was conducted: “Should the proposed CSD found in 20/0042r6 be accepted as the SENS SG CSD?” Results: Yes: 63, No: 0, Abstain: 25.Motion “Believing that the PAR contained in the document referenced below meets IEEE-SA guidelines, Request that the PAR contained in 19/2103r11 be posted to the IEEE 802 Executive Committee (EC) agenda for WG 802 preview and EC approval to submit to NesCom.”Move: Claudio da Silva (Intel)Second: Solomon Trainin (Qualcomm)Discussion: No discussion.Result: Yes: 69; No 0; Abstain 15.Motion “Believing that the CSD contained in the document referenced below meets IEEE 802 guidelines, Request that the CSD contained in 20/0042r6 be posted to the IEEE 802 Executive Committee (EC) agenda for WG 802 preview and EC approval.”Move: Claudio da Silva (Intel)Second: Solomon Trainin (Qualcomm)Discussion: No discussion.Result: Yes: 70; No 0; Abstain 14.Presentation of “Discussion of channel model for WLAN sensing,” doc. IEEE 11-20/0906r0, by Meihong Zhang (Huawei).Technical discussion on the need for the development of channel models for WLAN sensing, the scope of the potential work, and the identification of how the models will be used.Presentation of “Discussion on WLAN sensing evaluation methodology,” doc. IEEE 11-20/0907r1, by Rui Du (Huawei).Technical discussion on the need for the development of an evaluation methodology for WLAN sensing, the scope of the potential work, and the identification of how the methodology will be used.Meeting adjourned at 12:01pm ET.Teleconference on July 15th, 2020The IEEE 802.11 SENS SG teleconference was called to order at 10:00am ET by the Chair (Tony Xiao Han, Huawei).Attendance log can be found in Appendix 2.2.The agenda for the meeting can be found in IEEE 802.11-20/0996r4.3.Guidelines on “Meeting Protocol, Attendance, Voting & Document Status” (slide 4) were reviewed. No items noted.4.Patent policy guidelines (slides 6-9) were reviewed. No items noted.5.Guidelines on the IEEE Codes of Ethics & Conduct, "individual process," and "fair & equitable consideration" (slides 10-12) were reviewed. Required notices (slide 13) were also reviewed. No items noted.6.The proposed agenda (slide 16) was reviewed and approved without objection.Chair reviewed the call for contributions (slide 17), SENS SG timeline (slides 18 and 19), and future teleconference times (slide 20) slides.8.Presentation by Assaf Kasher (Qualcomm) of “Introduction to usage models document”, Doc. IEEE 11-20/0937r0, and “Usage model document,” Doc. IEEE 11-20/0936r0.Discussion on different aspects, such as some of the metrics in the proposal, and on the need for the development of usage models for WLAN sensing.Presenter indicated intention of running a SP in a few weeks. Members are encouraged to contribute to the development of the document (via email, for example).9.Presentation of “Usage model terminology for WLAN sensing” by Yingxiang Sun (Huawei), Doc. IEEE 11-20/0905r2.Presenter went over changes made to the document, compared to 20/0905r1, and addressed questions/comments from its last presentation to the group.10.Presentation of “Wireless Broadband Alliance sensing activities” by Chris Beg (Cognitive Systems, WBA), Doc. IEEE 11-20/0896r0.Presenter discussed various aspects of a testplan being developed by WBA of home monitoring WLAN sensing. Discussion of KPIs included in the testplan.Meeting adjourned at 12:01pm ET.Appendix 1: Attendance log for the July 14th, 2020 teleconferenceThe list below was recorded from IMAT and may be incomplete. AbidRabbu, Shaima'Istanbul Medipol University; VestelAgrawal, abhishekON SemiconductorAhn, WoojinKorea Railroad Research Institute (KRRI)AKHTAR, NADEEMArista Networks, Inc.Allegue Martinez, MichelAerial Technologies IncAnwyl, GaryRalink Technology, Corp.Au, Kwok ShumHuawei Technologies Co.,? LtdAu, OscarOrigin WirelessAwater, GeertQualcomm IncorporatedAygul, MehmetIstanbul Medipol University; VestelBajko, GaborMediaTek Inc.Batra, AnujApple, Inc.Baykas, TuncerVestelBeg, ChrisCognitive Systems Corp.Berger, ChristianNXP SemiconductorsBredewoud, AlbertBroadcom CorporationCalcev, GeorgeHuawei R&D USACarney, WilliamSony CorporationCavalcanti, DaveIntel CorporationCepni, GurkanApple, Inc.CHAN, YEEFacebookChen, ChengIntel CorporationChen, EvelynEricsson ABChen, NaMaxLinear CorpCheng, PaulMediaTek Inc.Cheng, XilinNXP SemiconductorsChitrakar, RojanPanasonic Asia Pacific Pte Ltd.Cho, HangyuLG ELECTRONICSChoi, JinsooLG ELECTRONICSCHUN, JINYOUNGLG ELECTRONICSCiochina, DanaSony CorporationCordeiro, CarlosIntel CorporationCosta, D.NelsonPeraso Technologies IncorporatedDash, DebashisAppleda Silva, ClaudioIntel Corporationde Vegt, RolfQualcomm IncorporatedDong, XiandongXiaomi Inc.Du, RuiHuawei Technologies Co., LtdEitan, AlecsanderQualcomm IncorporatedFang, YonggangZTE TX Incfeng, ShulingMediaTek Inc.Ganwani, VijayNXP SemiconductorsGarg, LalitBroadcom CorporationGrandhe, NiranjanNXP SemiconductorsGrigat, MichaelDeutsche Telekom AGGuntupalli, LakshmikanthEricsson ABHall, RobertJohnson Controls IncHAN, CHONGpureLiFiHan, JonghunSAMSUNGHAN, XiaoHuawei Technologies Co. LtdHan, ZhiqiangZTE CorporationHandte, ThomasSony CorporationHansen, ChristopherCovariant CorporationHaskou, AbdullahInterDigital, Inc.Hu, ChunyuFacebookHuang, LeiPanasonic Asia Pacific Pte Ltd.Jang, InsunLG ELECTRONICSJeffries, TimothyHuawei R&D USAJUNG, MYUNG CHEULPantech Inc.Kadampot, Ishaque AsharQualcomm IncorporatedKamel, MahmoudInterDigital, Inc.KANG, Kyu-MinElectronics and Telecommunications Research Institute (ETRI)Kasher, AssafQualcomm IncorporatedKhorov, EvgenyIITP RASKhude, NileshNXP SemiconductorsKim, JeongkiLG ELECTRONICSKim, Myeong-JinSAMSUNGkim, namyeongLG ELECTRONICSKim, Sang GookLG ELECTRONICSKim, SanghyunWILUS Inc.Ko, GeonjungWILUS InstituteKoc, OnurOnur Koc VestelKumar, ManishMarvell Semiconductor, Inc.Kureev, AlekseyIITP RASKwak, Jin-SamWILUS Inc.Kwon, Young HoonNXP SemiconductorsLe Houerou, BriceCanon Research Centre FranceLevitsky, IlyaIITP RASLi, QinghuaIntel CorporationLiang, dandanHuawei Technologies Co. LtdLIU, CHENCHENHuawei Technologies Co. LtdLiu, YongApple, Inc.Lv, kaiyingMediaTek Inc.Ma, LiMediaTek Inc.Mehrnoush, MortezaFacebookMemisoglu, EbubekirIMU, VESTELMerlin, SimoneQualcomm IncorporatedMohanty, BibhuQualcomm IncorporatedMontreuil, LeoBroadcom CorporationMurti, WisnuSeoulTechNagai, YukimasaMitsubishi Electric CorporationNikolich, Paulself employed/variousPare, ThomasMediaTek Inc.Parekh, JatinArista Networks, Inc.Park, EunsungLG ELECTRONICSPark, MinyoungIntelPatwardhan, GauravHewlett Packard EnterprisePetry, BrianBroadcom CorporationPettersson, CharlieEricsson ABPirhonen, RikuSelf EmployedPushkarna, RajatPanasonic Asia Pacific Pte Ltd.QIU, WEIHuawei Technologies Co., LtdRafique, SairaIstanbul Medipol University, VestelRaissinia, AlirezaQualcomm IncorporatedRantala, Enrico-HenrikNokiaRobert, JoergUniversity of Erlangen-NurembergRosdahl, JonQualcomm Technologies, Inc.Roy, SayakNXP SemiconductorsRyan, StuartBlu Wireless Technology Ltd.Sakoda, KazuyukiSony CorporationSalem, MohamedHuawei Technologies Co., LtdSato, NaotakaSony CorporationScott, AndyNCTASedin, JonasEricsson ABSerafimovski, NikolapureLiFiSethi, AnkitNXP SemiconductorsSherlock, IanTexas Instruments IncorporatedSmith, GrahamSR TechnologiesSolaija, Muhammad SohaibIstanbul Medipol University; VestelSon, Ju-HyungWILUS Inc.Song, TaewonLG ELECTRONICSStartsev, IvanIITPStavridis, AthanasiosEricsson ABStrauch, PaulQualcomm IncorporatedSumi, TakenoriMitsubishi Electric CorporationSun, YingxiangHuawei Technologies Co., LtdTan, DannyHuawei Technologies Co.,? LtdTeran, Jesus GutierrezIHP GmbHTorab Jahromi, PayamFacebookTrainin, SolomonQualcomm IncorporatedTurkmen, HaliseVestelVarshney, PrabodhNokiaVerenzuela, DanielSony CorporationVerma, LochanApple Inc.Wang, Chao ChunMediaTek Inc.Wang, HaoSelfWang, PuMitsubishi Electric Research Labs (MERL)Wang, Yi-HsiuZekuWant, RoyGoogleWinser, PaulBlu WirelessXin, YanHuawei Technologies Co. LtdXue, QiQualcomm IncorporatedXue, RuifengCisco Systems, Inc.YANG, RUIInterDigital, Inc.Yang, Steve TSMediaTek Inc.Yang, XunHuawei Technologies Co. LtdYano, KazutoAdvanced Telecommunications Research Institute International (ATR)Yee, JamesMediaTek Inc.Yong, Su KhiongApple, Inc.Yu, HeejungKorea UniversityYu, JianHuawei Technologies Co. LtdZeng, RuochenNXP SemiconductorsZHANG, JIAYINHuawei Technologies Co. LtdZhang, MeihongHuawei Technologies Co., LtdZheng, XiayuNXP SemiconductorsZhou, YifanHuawei Technologies Co., LtdAppendix 2: Attendance log for the July 15th, 2020 teleconferenceThe list below was recorded from IMAT and may be incomplete. Agrawal, SandeepC-DOT/Centre for Development of TelematicsAllegue Martinez, MichelAerial Technologies IncAn, Song-HaurINDEPENDENTAnsley, CarolCommScopeAnwyl, GaryMediaTek Inc.Arrington, ArthurAir Network SolutionsAu, Kwok ShumHuawei Technologies Co.,? LtdAu, OscarOrigin WirelessAuluck, VijaySelfAwater, GeertQualcomm IncorporatedAygul, MehmetVestal Company, Istanbul Medipol University;?Bajko, GaborMediaTek Inc.Batra, AnujApple Inc.Baykas, TuncerIstanbul Medipol UniversityBeg, ChrisCognitive Systems Corp.Berens, FriedbertFBConsulting SarlBerger, ChristianNXP SemiconductorsBerner, StephanPureLiFiCepni, GurkanApple Inc.Cheng, XilinNXP SemiconductorsCho, HangyuLG ELECTRONICSChoi, JinsooLG ELECTRONICSCordeiro, CarlosIntel CorporationCosta, D.NelsonPeraso Technologies IncorporatedDash, DebashisApple Inc.da Silva, ClaudioIntel CorporationDing, YanyiPanasonic corporationDOAN, DUNGQualcomm IncorporatedDu, RuiHuawei Technologies Co., LtdEitan, AlecsanderQualcomm IncorporatedEMMELMANN, MARCSelf Employed / Koden-TI / Fraunhofer FOKUSfeng, ShulingMediaTek Inc.Fletcher, PaulSamsung Cambridge Solution CenterFuruichi, ShoSony CorporationGanwani, VijayNXP SemiconductorsGrigat, MichaelDeutsche Telekom AGHall, RobertJohnson Controls IncHAN, XiaoHuawei Technologies Co. LtdHaskou, AbdullahInterDigital, Inc.Hsiao, Ching-WenMediaTek Inc.Hurtarte, JeorgeTeradyne, Inc.Ikegami, TetsushiMeiji UniversityJeffries, TimothyFuturewei TechnologiesJeon, EunsungSAMSUNG ELECTRONICSKadampot, Ishaque AsharQualcomm IncorporatedKain, CarlNoblis, Inc.Kamel, MahmoudInterDigital, Inc.Kasher, AssafQualcomm IncorporatedKenney, JohnTOYOTA InfoTechnology Center U.S.A.Kerry, StuartOK-BritKim, Sang GookLG ELECTRONICSKitazawa, ShoichiMuroran ITKoc, OnurOnur Koc VestelKureev, AlekseyIITP RASLansford, JamesQualcomm IncorporatedLee, Hyeong HoNetvision Telecom Inc.Lee, NancySignifyLi, QinghuaIntel CorporationLi, YanchunHuawei Technologies Co. LtdLim, Dong GukLG ELECTRONICSLopez, MiguelEricsson ABMa, LiMediaTek Inc.Mano, HiroshiKoden Techno Info K.K.Mehrnoush, MortezaFacebookMerlin, SimoneQualcomm IncorporatedMorioka, HitoshiSRC SoftwareMotozuka, HiroyukiPanasonic CorporationNagai, YukimasaMitsubishi Electric CorporationNakano, HirokiCAHI CorporationNikolich, Paulself employed/variousnoh, yujinNewracom Inc.Okada, HirakuNagoya UniversityOyama, SatoshiAssociation of Radio Industries and Businesses (ARIB)Pare, ThomasMediaTek Inc.PESIN, ANTHONYInterDigital, Inc.Pirhonen, RikuSelfPushkarna, RajatPanasonic Asia Pacific Pte Ltd.Rafique, SairaIstanbul Medipol University, VestelRantala, Enrico-HenrikNokiaRobert, JoergUniversity of Erlangen-NurembergRyan, MikeFord Motor CompanyRyan, StuartBlu Wireless Technology Ltd.Sadeghi, BaharehIntel CorporationSakamoto, TakenoriPanasonic CorporationSambasivan, SamAT&TSand, StephanGerman Aerospace Center (DLR)Sato, NaotakaSony CorporationSchelstraete, SigurdQuantenna Communications, Inc.Serafimovski, NikolapureLiFiSherlock, IanTexas Instruments IncorporatedSingh, GurdevSAMSUNG ELECTRONICSSosack, RobertMolex IncorporatedStavridis, AthanasiosEricsson ABStrauch, PaulQualcomm IncorporatedSU, HONGJIAHuawei Technologies Co.,? LtdSumi, TakenoriMitsubishi Electric CorporationSun, BoZTE CorporationSun, YingxiangHuawei Technologies Co. LtdTakai, MineoSpace-Time EngineeringTan, DannyHuawei Technologies Co., LtdTeran, Jesus GutierrezIHP GmbHTian, BinQualcomm IncorporatedTian, TaoUnisoc Comm.Trainin, SolomonQualcomm IncorporatedTurkmen, HaliseVestal Company, Istanbul Medipol University;?Varshney, PrabodhNokiaVermani, SameerQualcomm IncorporatedWang, PuMitsubishi Electric Research Labs (MERL)Wang, Yi-HsiuZekuWant, RoyGoogleWilhelmsson, LeifEricsson ABWinser, PaulBlu WirelessXue, QiQualcomm IncorporatedYAGHOOBI, HASSANIntel CorporationYANG, RUIInterDigital, Inc.Yang, XunHuawei Technologies Co. LtdYARKAN, SERHANIstanbul Commerce UniversityZEGRAR, Salah EddineVestel; Istanbul Medipol UniversityZeng, RuochenNXP SemiconductorsZhang, HongyuanMarvell Semiconductor, Inc.Zhang, MeihongHuawei Technologies Co., LtdZheng, XiayuNXP Semiconductors ................
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