CRYSTAL OSCILLATORS



SECTION C

CRYSTAL OSCILLATORS

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Table 1 REQUIREMENTS FOR CRYSTAL OSCILLATORS 1/ 2/

|Selection Priority |Use As Is |Screen to Table 2 |QCI to Table 3 |

|Level 1 | | | |

|1) MIL-PRF-55310, Class S |X | | |

|2) MIL-PRF-55310, Class B 3/ | |X | |

|3) SCD | |X |X |

|Level 2 | | | |

|1) MIL-PRF-55310, Class B | |X | |

|MIL-PRF-55310, Class S |X | | |

|SCD | |X |X |

|Commercial | |X |X |

|Level 3 | | | |

|MIL-PRF-55310, Class B |X | | |

|MIL-PRF-55310, Class S |X | | |

|3) Commercial | |X | |

Notes:

1/ Refer to paragraph 6.0, INSTRUCTIONS, pages 2 through 5, for general part requirements applicable to all part types.

2/ Crystal Oscillators, which employ custom (as opposed to catalog) hybrid microcircuits, shall satisfy the element evaluation requirements of Section I herein.

3/ Class B Crystal Oscillators are acceptable as Level 1 parts only when Class S Oscillators are not available.

Table 2 SCREENING REQUIREMENTS FOR CRYSTAL OSCILLATORS,

DISCRETE COMPONENT CONSTRUCTION (Page 1 of 3)

| |Test Methods and |Level 1 |Level 2 |Level 3 |

|Inspection/Test |Conditions 1/ |SCD |Class B |Class B |SCD |Commercial |Commercial |

|1. Internal Visual Inspection | |X | | |X | | |

|a. Soldering 2/ |MIL-S-45743 | | | | | | |

|b. Workmanship |MIL-PRF-55310, paragraph 3.9 | | | | | | |

|2. Random Vibration |MIL-STD-202, Method 214, Condition I-B, 5 |X | | | | | |

| |minutes per axis | | | | | | |

|3. Thermal Shock |MIL-STD-202, Method 107, Condition A-1 |X | | |X |X | |

|4. Pre Burn-In Electrical | |X | | |X |X |X |

|Input Current - Power |Measure oscillators input current or calculate | | | | | | |

| |power from measured voltage and current. | | | | | | |

| |Measure oven input current or calculate power | | | | | | |

| |for types 4 and 6. For 8 oscillators | | | | | | |

| |determine syntonization energy, | | | | | | |

| |Q=E I(t)dt, from measured | | | | | | |

| |value of current. Approximate with the | | | | | | |

| |Trapezoidal Rule for n=10 equally spaced | | | | | | |

| |intervals. | | | | | | |

| | | | | | | | |

| |Verify the type of output waveform. | | | | | | |

| | | | | | | | |

| | | | | | | | |

|Output Waveform | | | | | | | |

Notes at end of Table 2

Table 2 SCREENING REQUIREMENTS FOR CRYSTAL OSCILLATORS,

DISCRETE COMPONENT CONSTRUCTION (Page 2 of 3)

| |Test Methods and |Level 1 |Level 2 |Level 3 |

|Inspection/Test |Conditions 1/ |SCD |Class B |Class B |SCD |Commercial |Commercial |

| Output Voltage - Power |Measure output voltage and measure or calculate |X | | |X |X | |

| |output power. For VCOs, turn off the | | | | | | |

| |modulation-control input voltage and specify the | | | | | | |

| |dc input reference level. For square wave output | | | | | | |

| |waveforms, output logic levels shall be measured | | | | | | |

| |across a specified load. 3/ | | | | | | |

|5. Burn-In (Load) |Max. operating temperature. Nominal supply |240 Hours | | |160 Hours |160 Hours |48 Hours |

| |voltage and load as specified. | | | | | | |

|6. Post Burn-In Electrical |Repeat step 4 above |X | | |X |X |X |

|7. Frequency Aging |70°C (room temperature for oven controlled |30 days | | | | | |

| |oscillators). Stabilize 1 hour (48 hours for | | | | | | |

| |types 3 and 8). Measure initial frequency after | | | | | | |

| |stabilization and at intervals not to exceed 72 | | | | | | |

| |hours (20 hours for types 3 thru 8 with 4 | | | | | | |

| |measurements per week). Change between initial | | | | | | |

| |and any subsequent frequency shall not exceed | | | | | | |

| |specified value. See MIL-PRF-55310. | | | | | | |

|8. PDA 4/ | |5% | | |10% |10% |20% |

|9. Radiographic Inspection |MIL-STD-202, Method 209, 1 View 1 in Y1 Direction,|X |X |X |X |X | |

| |2nd View 90 Relative to 1st View | | | | | | |

|10. Additional Electrical Measurements |Table 4 Herein |X | | | | | |

Notes at end of Table 2

Table 2 SCREENING REQUIREMENTS FOR CRYSTAL OSCILLATORS,

DISCRETE COMPONENT CONSTRUCTION (Page 3 of 3)

| |Test Methods and |Level 1 |Level 2 |Level 3 |

|Inspection/Test |Conditions 1/ |SCD |Class B |SCD |Commercial |Commercial |

|11. Seal Test |MIL-STD-202, Method 112 and MIL-PRF-55310, |X | |X |X | |

| |Paragraph 4.9.2 | | | | | |

Notes:

1/ It is the responsibility of the user to specify detail test conditions and define pass/fail criteria for each test. These values shall be based on the nearest equivalent military specifications, the manufacturer’s specification, or the application, whichever is more severe. MIL-O-55310 is the reference specification.

2/ Certification of soldering personnel is required.

3/ Test loads for TTL and CMOS compatible oscillator shall be as shown in Figure 7 of MIL-PRF-55310 unless otherwise specified.

4/ Percent Defective Allowable (PDA) calculations shall include both burn-in and frequency aging failures for Grade 1 parts.

Table 2A SCREENING REQUIREMENTS FOR CRYSTAL OSCILLATORS,

HYBRID MICROCIRCUIT CONSTRUCTION (Page 1 of 2)

| |MIL-STD-883 1/ |Level 1 |Level 2 |Level 3 |

|Inspection/Test |Method |Conditions |SCD |Class B |Class B |SCD |Commercial |Commercial |

|1. Non Destructive Bond Pull |2023 | |X | | | | | |

|2. Internal Visual |2017 | |X | | |X |X 2/ | |

|3. Stabilization Bake (Prior to Seal) |1008 |C, 150C, |X | | |X |X | |

| | |Min. Hours |48 | | |24 |24 | |

|4. Thermal Shock |1011 |A |X | | | | | |

|5. Temperature Cycling |1010 |B |X | | |X |X | |

|6. Constant Acceleration |2001 |A, Y1 only, 5000G's |X | | |X |X | |

|7. PIND |2020 |B |X |X |X |X |X | |

|8. Pre Burn-In Electrical | |X | | | |X |X |

|Input Current - Power |Measure oscillators input current or calculate | | | | | | |

| |power from measured voltage and current. | | | | | | |

| |Measure oven input current or calculate power | | | | | | |

| |for types 4 and 6. For 8 oscillators | | | | | | |

| |determine syntonization energy, | | | | | | |

| |Q=E I(t)dt, from measured | | | | | | |

| |value of current. Approximate with the | | | | | | |

| |Trapezoidal Rule for n=10 equally spaced | | | | | | |

| |intervals. | | | | | | |

| | | | | | | | |

| |Verify the type of output waveform | | | | | | |

| | | | | | | | |

|Output Waveform | | | | | | | |

| Output Voltage - Power |Measure output voltage and measure or calculate| | | | | | |

| |output power. For VCOs, turn off the | | | | | | |

| |modulation-control input voltage and specify | | | | | | |

| |the dc input reference level. For square wave | | | | | | |

| |output waveforms, output logic levels shall be | | | | | | |

| |measured across a specified load. 3/ | | | | | | |

Notes at end of Table 2A

Table 2A SCREENING REQUIREMENTS FOR CRYSTAL OSCILLATORS,

HYBRID MICROCIRCUIT CONSTRUCTION (Page 2 of 2)

| |MIL-STD-883 |Level 1 |Level 2 |Level 3 |

|Inspection/Test |Method |Conditions |SCD |Class B |Class B |SCD |Commercial |Commercial |

|9. 9. Burn-In (Load) | |125C, Nominal Supply |240 Hours | | |160 Hours |160 Hours |48 |

| | |Voltage and Burn-In Loads | | | | | | |

|10. Post Burn-In Electrical | |Repeat Step 8 Above |X | | |X |X |X |

|11. Frequency Aging |70°C (room temperature for oven controlled |30 days | | | | | |

| |oscillators). Stabilize 1 hour (48 hours for | | | | | | |

| |types 3 and 8). Measure initial frequency after | | | | | | |

| |stabilization and at intervals not to exceed 72 | | | | | | |

| |hours (20 hours for types 3 thru 8 with 4 | | | | | | |

| |m3asurements per week). Change between initial | | | | | | |

| |and any subsequent frequency shall not exceed | | | | | | |

| |specified value. See MIL-O-55310. | | | | | | |

|12. PDA 4/ | | |5% | | |10% |10% |20% |

|13. Additional Electrical Measurements | |Table 2B Herein |X | | | | | |

|14. Radiographic Inspection |2012 | |X |X |X |X |X | |

|15. Seal Test |1014 | |X | | |X |X |X |

|a. Fine Leak | |A or B | | | | | | |

|b. Gross Leak | |C | | | | | | |

Notes:

1/ It is the responsibility of the user to specify detail test conditions and define pass/fail criteria for each test. These values shall be based on the nearest equivalent military specifications, the manufacturer’s specification, or the application, whichever is most severe. MIL-PRF-55310 is the reference specification.

2/ DPA in accordance with GSFC 311M-70 may be performed in lieu of internal visual.

3/ Test loads for TTL and CMOS compatible oscillators shall be as shown in Figure 7 of MIL-PRF-55310 unless otherwise specified.

4/ Percent Defective Allowable (PDA) calculations shall include both burn-in and frequency aging failures for Level 1 Parts.

Table 2B ADDITIONAL ELECTRICAL MEASUREMENTS (Page 1 of 2)

| |Test Methods, Conditions and Requirements 1/ | |

|Test | |Type 2/ |

|1. Oscillator Supply Voltage |Measure voltage magnitude, tolerance, polarity, regulation, peak to peak ripple, ripple frequency and noise across oscillator|All |

| |input terminals with specified load. | |

|2. Modulation - Control Input Voltage |Same as 1 above, but also measure modulation magnitude and dc level limits or dc control magnitude |2, 5, 6 |

|3. Oven Supply Voltage |Same as 1 above, but measure oven voltage etc. across input terminals of oven. |4, 6 |

|4. Overvoltage Survivability |Apply overvoltage 20% above maximum specified supply voltage for 1 minute, with no performance degradation. Do not exceed |All |

| |16.5 volts for oscillators employing CMOS parts. | |

|5. Frequency Adjustment |Stabilize at reference temperature and determine by frequency measurements that output signal can be set to either nominal |Adjustable |

| |frequency or marked frequency offset with specified resolution and adjusted oven specified range. | |

|6. Initial Frequency - Temperature Accuracy |Stabilize at lowest specified temperature and measure frequency. Increase temperature in specified steps (allowing |All |

| |stabilization) and record frequency until highest specified temperature is reached. Calculate frequency-temperature accuracy| |

| |in accordance with paragraph 4.9.10.1. | |

|7. Frequency-Voltage Tolerance |Set oscillator supply voltage (oven supply voltage, if applicable) to nominal, minimum, and maximum values and measure output|All |

| |frequency. Determine frequency-voltage tolerance in accordance with paragraph 4.9.14. | |

|8. Rise and Fall Times |Measure between specified voltage levels. For TTL and CMOS compatible oscillators, the lower measurement level shall be 0.8 |Square Wave |

| |volts and 10% of signal level respectively. The upper measurement level shall be 2.0 volts and 90% of signal level | |

| |respectively. | |

|9. Duty Cycle |Measure at 50% voltage level, referenced to ground, and express as percent of wave form period. The measurement level for |Square Wave |

| |TTL and CMOS compatible oscillators shall be 1.4 volts and 50% VDD respectively. | |

|10. Modulation-Control Input Impedance |Apply modulation-control input voltage to input terminals through series resistance. Measure voltage across series resistor |2, 5, 6 |

| |and input terminals and calculate input impedance in accordance with paragraph 4.9.29. | |

|11. Frequency Deviation |Assemble test equipment in accordance with Figure 13 of MIL-PRF-55310, and measure (calculate) total deviation, deviation |2, 5, 6 |

| |slope polarity, and deviation linearity in accordance with paragraph 4.9.30. | |

Notes at end of Table 2B.

Table 2B ADDITIONAL ELECTRICAL MEASUREMENTS (Page 2 of 2)

Notes:

1/ It is the responsibility of the user to specify detail test conditions and define pass/fail criteria for each test. These values shall be based on the nearest equivalent military specifications, the manufacturer’s specification, or the application, whichever is most severe. MIL-PRF-55310 is the reference specification.

2/ TYPES

Type 1 - Crystal Oscillators (XO)

Type 2 - Voltage Controller Crystal Oscillators (VCXO)

Type 3 - Temperature Compensated Crystal Oscillators (TCXO)

Type 4 - Oven Control Crystal Oscillators (OXCO)

Type 5 - Temperature Compensated-Voltage Controlled Crystal Oscillators (TCVCXO)

Type 6 - Oven Controlled Voltage Controlled Crystal Oscillators (OCVCXO)

Type 7 - Microcomputer Compensated Crystal Oscillators (MCXO)

Type 8 - Rubidium - Crystal Oscillators (RUXO)

Table 3 QUALIFICATION TEST REQUIREMENTS FOR CRYSTAL OSCILLATORS (Page 1 of 2)

| | |Quantity (Accept number) |

| |Test Methods |Level 1 |Level 2 |Level 3 |

|Inspection/Test |and Conditions |SCD |Class B |Class B |SCD |Commercial 1/ |Commercial |

|Group 1 | |3(0) | | |2(0) |2(0) |Not |

|Physical Dimensions |MIL-STD-883, Method 2016 | | | | | |Required |

| |In case of failure, 100% inspection shall be | | | | | | |

| |performed | | | | | | |

|Solderability |MIL-STD-202, Method 208 | | | | | | |

| |Each Lead | | | | | | |

|Resistance to Solvents |MIL-STD-202, Method 215 | | | | | | |

|Group 2 | |3(0) | | |2(0) |2(0) | |

|Resistance to Soldering Heat |MIL-STD-202, Method 210 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.48 | | | | | | |

|Moisture Resistance |MIL-STD-202, Method 106 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.49 | | | | | | |

|Group 3 | |6(0) |6(0) | |4(0) |4(0) | |

|Thermal Shock |MIL-STD-202, Method 107 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.44 | | | | | | |

|Mechanical Shock |MIL-STD-202, Method 213 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.40 | | | | | | |

|Vibration, Sine |MIL-STD-202, Method 204 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.38-1 | | | | | | |

|Thermal Strength |MIL-STD-202, Method 211 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.51 | | | | | | |

|Hermetic Seal |MIL-STD-202, Method 112 and | | | | | | |

| |MIL-PRF-55310, Paragraph 4.9.2 | | | | | | |

Notes at end of Table 3

Table 3 QUALIFICATION TEST REQUIREMENTS FOR CRYSTAL OSCILLATORS (Page 2 of 2)

| | |Quantity (Accept number) |

| |Test Methods |Level 1 |Level 2 |Level 3 |

|Inspection/Test |and Conditions |SCD |Class B |Class B |SCD |Commercial 1/ |Commercial |

|Group 4 | |3 (0) |3(0) |3(0) |3(0) |3(0) |Not |

| | |or 5 (1) |or 5 (1) |or 5 (1) |or 5 (1) |or 5 (1) |Required |

|Internal Water Vapor Content 2/ |MIL-STD-883, Method 1018 | | | | | | |

| |5000ppm at 100C | | | | | | |

|Group 5 | |12 (0) |6 (0) | |8 (0) |8 (0) | |

| | | | | | | | |

|Frequency Aging |MIL-O-55310, paragraph 4.9.34 | | | | | | |

Notes:

1/ Generic data less than 1 year old is an acceptable basis for qualification if it satisfies the requirements specified herein.

2/ Applies only to hybrid microcircuit construction. Generic data is never acceptable.

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