REMOVING COMTAMINATES FROM SILICON WAFERS
Opticlean®, oxygen plasma etch, high intensity UV light and Opticlean® followed with an oxygen plasma etch are evaluated as possible methods for removing the organic contaminates from the surface of silicon wafers. ... (Saunders College Publishing, Fort Worth, 2000), 5th Ed., p. 1296. [4] S. Lunt, M. S. Thesis, “Determining the Indices of ... ................
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