Yield Modeling and Analysis Prof. Robert C. Leachman IEOR ...
Yield losses from wafer fabrication take two forms: line yield and die yield. Line yield losses result from physical damage of the wafers due to mishandling, or by mis-processing of the wafer (e.g., skipping or duplicating a process step, wrong recipe, equipment out of control, etc.). Mis-processing is detected either by in-line inspections ................
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