Open Compute



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License (OCP CLA Option)

Contributions to this Specification are made under the terms and conditions set forth in Open Compute Project Contribution License Agreement (“OCP CLA”) (“Contribution License”) by:

[Contributor Name(s) or Company name(s)]

You can review the signed copies of the applicable Contributor License(s) for this Specification on the OCP website at  

Usage of this Specification is governed by the terms and conditions set forth in [select one: Creative Commons Attribution 4.0 International License, Open Web Foundation Final Specification Agreement (“OWFa 1.0”), Open Compute Project Hardware License – Permissive (“OCPHL Permissive”), Open Compute Project Hardware License – Copyleft (“OCPHL Reciprocal”)] (“Specification License”).

You can review the applicable Specification License(s) executed by the above referenced contributors to this Specification on the OCP website at

 Note: The following clarifications, which distinguish technology licensed in the Contribution License and/or Specification License from those technologies merely referenced (but not licensed), were accepted by the Incubation Committee of the OCP:

[insert “None” or a description of the applicable clarifications].

NOTWITHSTANDING THE FOREGOING LICENSES, THIS SPECIFICATION IS PROVIDED BY OCP "AS IS" AND OCP EXPRESSLY DISCLAIMS ANY WARRANTIES (EXPRESS, IMPLIED, OR OTHERWISE), INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR A PARTICULAR PURPOSE, OR TITLE, RELATED TO THE SPECIFICATION. NOTICE IS HEREBY GIVEN, THAT OTHER RIGHTS NOT GRANTED AS SET FORTH ABOVE, INCLUDING WITHOUT LIMITATION, RIGHTS OF THIRD PARTIES WHO DID NOT EXECUTE THE ABOVE LICENSES, MAY BE IMPLICATED BY THE IMPLEMENTATION OF OR COMPLIANCE WITH THIS SPECIFICATION. OCP IS NOT RESPONSIBLE FOR IDENTIFYING RIGHTS FOR WHICH A LICENSE MAY BE REQUIRED IN ORDER TO IMPLEMENT THIS SPECIFICATION. THE ENTIRE RISK AS TO IMPLEMENTING OR OTHERWISE USING THE SPECIFICATION IS ASSUMED BY YOU. IN NO EVENT WILL OCP BE LIABLE TO YOU FOR ANY MONETARY DAMAGES WITH RESPECT TO ANY CLAIMS RELATED TO, OR ARISING OUT OF YOUR USE OF THIS SPECIFICATION, INCLUDING BUT NOT LIMITED TO ANY LIABILITY FOR LOST PROFITS OR ANY CONSEQUENTIAL, INCIDENTAL, INDIRECT, SPECIAL OR PUNITIVE DAMAGES OF ANY CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS SPECIFICATION, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), OR OTHERWISE, AND EVEN IF OCP HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

License (OWF option)

Contributions to this Specification are made under the terms and conditions set forth in Open Web Foundation Contributor License Agreement (“OWF CLA 1.0”) (“Contribution License”) by:

[Contributor Name(s) or Company name(s)]

You can review the signed copies of the applicable Contributor License(s) for this Specification on the OCP website at  

Usage of this Specification is governed by the terms and conditions set forth in [select one: Open Web Foundation Final Specification Agreement (“OWFa 1.0”), Open Compute Project Hardware License – Permissive (“OCPHL Permissive”), Open Compute Project Hardware License – Copyleft (“OCPHL Reciprocal”)] (“Specification License”).

You can review the applicable Specification License(s) executed by the above referenced contributors to this Specification on the OCP website at

 Note: The following clarifications, which distinguish technology licensed in the Contribution License and/or Specification License from those technologies merely referenced (but not licensed), were accepted by the Incubation Committee of the OCP:

[insert “None” or a description of the applicable clarifications].

NOTWITHSTANDING THE FOREGOING LICENSES, THIS SPECIFICATION IS PROVIDED BY OCP "AS IS" AND OCP EXPRESSLY DISCLAIMS ANY WARRANTIES (EXPRESS, IMPLIED, OR OTHERWISE), INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR A PARTICULAR PURPOSE, OR TITLE, RELATED TO THE SPECIFICATION. NOTICE IS HEREBY GIVEN, THAT OTHER RIGHTS NOT GRANTED AS SET FORTH ABOVE, INCLUDING WITHOUT LIMITATION, RIGHTS OF THIRD PARTIES WHO DID NOT EXECUTE THE ABOVE LICENSES, MAY BE IMPLICATED BY THE IMPLEMENTATION OF OR COMPLIANCE WITH THIS SPECIFICATION. OCP IS NOT RESPONSIBLE FOR IDENTIFYING RIGHTS FOR WHICH A LICENSE MAY BE REQUIRED IN ORDER TO IMPLEMENT THIS SPECIFICATION. THE ENTIRE RISK AS TO IMPLEMENTING OR OTHERWISE USING THE SPECIFICATION IS ASSUMED BY YOU. IN NO EVENT WILL OCP BE LIABLE TO YOU FOR ANY MONETARY DAMAGES WITH RESPECT TO ANY CLAIMS RELATED TO, OR ARISING OUT OF YOUR USE OF THIS SPECIFICATION, INCLUDING BUT NOT LIMITED TO ANY LIABILITY FOR LOST PROFITS OR ANY CONSEQUENTIAL, INCIDENTAL, INDIRECT, SPECIAL OR PUNITIVE DAMAGES OF ANY CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS SPECIFICATION, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), OR OTHERWISE, AND EVEN IF OCP HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

Table of Contents

1. License (OCP CLA Option) 2

1. License (OWF option) 3

Table of Contents 4

2. Scope 9

Overview 10

3. Rack Compatibility 12

4. Physical Specifications 12

4.1 Block Diagram 12

4.2 Placement and Form Factor 12

4.3 CPU and Memory 12

4.4 Platform Controller Hub (PCH) 12

4.5 PCIe 12

4.6 12

4.7 PCB Stack‐Up 12

4.8 Figures & Illustrations 12

5. BIOS 12

5.1 BIOS Chip 12

5.2 BIOS Source Code 12

5.3 BIOS Feature Requirements 12

5.4 Firmware Feature Plan of Record 12

6. BMC 12

6.1 Management Network Interface 12

6.2 Local Serial Console and SOL 12

6.3 Graphic and GUI 12

6.4 Remote Power Control and Power policy 12

6.5 Port 80 POST 12

6.6 Power and System Identification LED 12

6.7 Platform Environment Control Interface (PECI) 12

6.8 Power and Thermal Monitoring and power limiting 12

6.9 SMBUS Diagram 12

6.10 Sensors/Events 12

6.11 SEL 12

6.12 FSC in BMC 12

6.13 OEM commands 12

6.14 BMC FW chip and Firmware Update 12

6.15 BMC Update Dual PCH flash 12

6.16 BMC Update and Access CPLD 12

6.17 BMC Time Sync 12

6.18 PCIe and Mezzanine card Thermal monitoring 12

6.19 BMC PPIN Implementation 13

6.20 BMC Average Power Reporting 13

6.21 BMC Access and Update VR Firmware 13

6.22 BMC MSR Dump from OOB 13

6.23 BMC Network Status 13

6.24 BMC Secure boot. 13

7. Thermal Design Requirements 13

7.1 Data Center Environmental Conditions 13

7.2 Server operational condition 13

7.3 Thermal Kit Requirements 13

8. I/O System 13

8.1 PCIe x32 Slot/Riser Card 13

8.2 DIMM Sockets 13

8.3 Mezzanine Card 13

8.4 Network 13

8.5 USB 13

8.6 SATA 13

8.7 M.2 13

8.8 Debug Header 13

8.9 Switches and LEDs 13

8.10 Fan connector. 13

8.11 TPM Connector and Module 13

8.12 Sideband Connector 13

8.13 VGA header 13

9. Rear Side Power, I/O and Midplane 13

9.1 Overview of Footprint and Population Options 13

9.2 Rear Side Connectors 13

9.3 Midplane 13

10. ORv2 Implementation 13

10.1 Cubby for ORv2 13

10.2 Intel Motherboard V4.0‐ORv2 Power Delivery 13

10.3 Intel Motherboard V4.0‐ORv2 Single‐Side Sled 13

10.4 Intel Motherboard V4.0‐ ORv2 Double Side Sled 13

11. Mechanical 14

11.1 Single Side Sled mechanical 14

11.2 Double Side Sled Mechanical 14

11.3 Fixed Locations 14

11.4 PCB Thickness 14

11.5 Heat Sinks and ILM 14

11.6 Silk Screen 14

11.7 DIMM Connector Color 14

11.8 PCB Color 14

12. Motherboard Power System 14

12.1 Input Voltage 14

12.2 Hot‐Swap Controller (HSC) Circuit 14

12.3 CPU VR 14

12.4 DIMM VR 14

12.5 MCP (Multi Core Package) VRM 14

12.6 6 VRM design guideline 14

12.7 Hard Drive Power 14

12.8 System VRM efficiency 14

12.9 Power On 14

12.10 High power use case... 14

12.11 14

13. Environmental and Regulations 14

14. Environmental Requirements 14

14.1 Vibration & Shock 14

14.2 Regulations 14

14.3 Labels and Markings 14

15. Prescribed Materials 14

15.1 Disallowed Components 14

15.2 Capacitors & Inductors 14

15.3 Component De‐rating 14

16. Reliability and Quality 14

16.1 Specification Compliance 15

16.2 Change Orders 15

16.3 Failure Analysis 15

16.4 Warranty 15

16.5 MTBF Requirements 15

16.6 Control Change Authorization and Revision Control 15

16.7 PCB Tests 15

16.8 Secondary Component 15

Scope

This document defines the technical specifications for the used in Open Compute Project

Overview

Sections 3 – 18 are suggested or example sections.

Rack Compatibility

Physical Specifications

1 Block Diagram

2 Placement and Form Factor

3 CPU and Memory

4 Platform Controller Hub (PCH)

5 PCIe

6 PCB Stack‐Up

7 Figures & Illustrations

BIOS

1 BIOS Chip

2 BIOS Source Code

3 BIOS Feature Requirements

4 Firmware Feature Plan of Record

BMC

1 Management Network Interface

2 Local Serial Console and SOL

3 Graphic and GUI

4 Remote Power Control and Power policy

5 Port 80 POST

6 Power and System Identification LED

7 Platform Environment Control Interface (PECI)

8 Power and Thermal Monitoring and power limiting

9 SMBUS Diagram

10 Sensors/Events

11 SEL

12 FSC in BMC

13 OEM commands

14 BMC FW chip and Firmware Update

15 BMC Update Dual PCH flash

16 BMC Update and Access CPLD

17 BMC Time Sync

18 PCIe and Mezzanine card Thermal monitoring

19 BMC PPIN Implementation

20 BMC Average Power Reporting

21 BMC Access and Update VR Firmware

22 BMC MSR Dump from OOB

23 BMC Network Status

24 BMC Secure boot.

Thermal Design Requirements

1 Data Center Environmental Conditions

2 Server operational condition

3 Thermal Kit Requirements

I/O System

1 PCIe x32 Slot/Riser Card

2 DIMM Sockets

3 Mezzanine Card

4 Network

5 USB

6 SATA

7 M.2

8 Debug Header

9 Switches and LEDs

10 Fan connector.

11 TPM Connector and Module

12 Sideband Connector

13 VGA header

Rear Side Power, I/O and Midplane

1 Overview of Footprint and Population Options

2 Rear Side Connectors

3 Midplane

ORv2 Implementation

1 Cubby for ORv2

2 Intel Motherboard V4.0‐ORv2 Power Delivery

3 Intel Motherboard V4.0‐ORv2 Single‐Side Sled

4 Intel Motherboard V4.0‐ ORv2 Double Side Sled

Mechanical

1 Single Side Sled mechanical

2 Double Side Sled Mechanical

3 Fixed Locations

4 PCB Thickness

5 Heat Sinks and ILM

6 Silk Screen

7 DIMM Connector Color

8 PCB Color

Motherboard Power System

1 Input Voltage

2 Hot‐Swap Controller (HSC) Circuit

3 CPU VR

4 DIMM VR

5 MCP (Multi Core Package) VRM

6 6 VRM design guideline

7 Hard Drive Power

8 System VRM efficiency

9 Power On

10 High power use case...

11

Environmental and Regulations

Environmental Requirements

1 Vibration & Shock

2 Regulations

3 Labels and Markings

Prescribed Materials

1 Disallowed Components

2 Capacitors & Inductors

3 Component De‐rating

Reliability and Quality

1 Specification Compliance

2 Change Orders

3 Failure Analysis

4 Warranty

5 MTBF Requirements

6 Control Change Authorization and Revision Control

7 PCB Tests

8 Secondary Component

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