28V, 0.5A Step-Down Converters with Sleep Mode (Rev. B)

[Pages:36]TPS62175, TPS62177



SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014

28V, 0.5A Step-Down Converter with Sleep Mode

Check for Samples: TPS62175, TPS62177

FEATURES

1

?23 DCS-ControlTM Topology ? Input Voltage Range 4.75 to 28V ? Quiescent Current typ. 4.8?A (Sleep Mode) ? 100% Duty Cycle Mode ? Active Output Discharge ? Power Good Output ? Output Current of 500mA ? Output Voltage Range 1V to 6V ? Switching Frequency of Typically 1MHz ? Seamless Power Save Mode Transition ? Undervoltage Lockout ? Short Circuit Protection ? Over Temperature Protection ? Available in 2 x 3 mm 10-pin WSON Package

APPLICATIONS

? General 12V/24V Point Of Load Supply ? Ultra Mobile PC, Embedded PC ? Low Power Supply for Microprocessor ? High Efficiency LDO Alternative ? Industrial Sensors

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4.75 to 28V VIN

10uH SW

DESCRIPTION

The TPS62175/7 is a high efficiency synchronous step-down DC-DC converter, based on the DCSControlTM topology.

With a wide operating input voltage range of 4.75 to 28V, the device is ideally suited for systems powered from multi cell Li-Ion as well as 12V and even higher intermediate supply rails, providing up to 500mA output current.

The TPS62175/7 automatically enters Power Save Mode at light loads, to maintain high efficiency across the whole load range. As well, it features a Sleep Mode to supply applications with advanced power save modes like ultra low power micro controllers. The Power Good output may be used for power sequencing and/or Power On Reset.

The device features a typical quiescent current of 22uA in normal mode and 4.8uA in Sleep Mode. In Sleep Mode, the efficiency at very low load currents can be increased by as much as 20%. In shutdown mode, the shutdown current is less than 2uA and the output is actively discharged.

The TPS62175/7, available in an adjustable and a fixed output voltage version, is packaged in a small 2x3mm 10-pin WSON package.

3.3V/0.5A

2.2uF

EN TPS62177 VOS

SLEEP

PG

100k

22uF

AGND

FB

PGND

NC

Figure 1. Typical Application and Efficiency

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DCS-Control is a trademark of Texas Instruments.

2

ARM Cortex is a trademark of ARM Limited.

3

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright ? 2012?2014, Texas Instruments Incorporated

TPS62175, TPS62177

SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014



These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

TA

OUTPUT VOLTAGE (2)

-40?C to 85?C

adjustable 3.3 V

ORDERING INFORMATION(1)(2)

PART NUMBER

PACKAGE

TPS62175 TPS62177

10-Pin WSON

ORDERING

TPS62175DQC TPS62177DQC

PACKAGE MARKING

62175

62177

(1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet. (2) Contact the factory to check availability of other output voltage or current limit versions.

ABSOLUTE MAXIMUM RATINGS(1)

Pin Voltage Range (2)

Power Good Sink Current Temperature Range

ESD rating(3)

VIN EN, SW FB, PG, VOS, SLEEP, NC PG

Operating junction temperature, TJ Storage temperature, Tstg HBM Human body model CDM Charge device model

MIN

MAX

UNIT

-0.3

30

V

-0.3

VIN+0.3

V

-0.3

7

V

10

mA

-40

125

?C

-65

150

2

kV

0.5

kV

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2) All voltages are with respect to network ground terminal. (3) ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATION

THERMAL METRIC(1)

JA JC(TOP) JB JT JB JC(BOTTOM)

Junction-to-ambient thermal resistance Junction-to-case(top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter Junction-to-case(bottom) thermal resistance

TPS62175/7 DQC (10) PINS

61.6 65.5 22.5 1.4 22.4 5.3

UNITS ?C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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RECOMMENDED OPERATING CONDITIONS

Supply Voltage, VIN Operating free air temperature, TA Operating junction temperature, TJ

MIN

MAX

UNIT

4.75

28

V

?40

85

?C

?40

125

?C

2

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SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014

ELECTRICAL CHARACTERISTICS

over free-air temperature range (TA=-40?C to +85?C) and VIN=4.75 to 28V. Typical values at VIN=12V and TA=25?C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN TYP MAX UNIT

SUPPLY

VIN

Input Voltage Range

IQ

Operating Quiescent Current

EN=High, SLEEP=High, IOUT=0mA, device not switching

4.75

28 V

22 36 ?A

IQ_SLEEP

Sleep Mode Quiescent EN=High, SLEEP=Low, IOUT=0mA, device not switching Current

4.8 10 ?A

ISD VUVLO

Shutdown Current

Undervoltage Lockout Threshold

EN=Low, current into VIN pin Rising Input Voltage Falling Input Voltage

1.5

5 ?A

4.5 4.6 4.7 V

2.9

V

TSD

Thermal Shutdown

Rising Junction Temperature

Temperature

Thermal Shutdown Hysteresis

150 ?C

20

CONTROL (EN, PG, SLEEP)

High Level Input

VH

Threshold Voltage (EN,

SLEEP)

0.9

V

VL

Low Level Input

Threshold Voltage (EN,

SLEEP)

0.3 V

ILKG_EN

Input Leakage Current (EN)

EN=VIN

5 300 nA

ILKG_SLEEP

Input Leakage Current (SLEEP)

VSLEEP = 3.3V

1.4

?A

VTH_PG VOL_PG

Power Good Threshold Voltage

Power Good Output Low Voltage

Rising (%VOUT) Falling (%VOUT)

IPG = -2mA

93

96 99

%

87

90 93

0.3 V

ILKG_PG

Input Leakage Current (PG)

VPG = 5V

5 300 nA

POWER SWITCH

RDS(ON)

High-Side MOSFET ON-Resistance

Low-Side MOSFET ON-Resistance

VIN 6V VIN 6V

850 1430 m 320 530 m

ILIMF

High-Side MOSFET Current Limit

Normal Operation Startup Mode

800 1000 1200 mA

450 525 600

OUTPUT

VOUT

Output Voltage Range VIN VOUT (TPS62175)

1

6V

VREF

Internal Reference Voltage

0.8

V

IOUT_SLEEP Output Current in Sleep SLEEP= Low, VOUT=3.3V, L=10?H Mode

15

mA

ILKG_FB

Input Leakage Current (FB)

VFB= 0.8V

1 100 nA

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SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014



ELECTRICAL CHARACTERISTICS (continued)

over free-air temperature range (TA=-40?C to +85?C) and VIN=4.75 to 28V. Typical values at VIN=12V and TA=25?C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN TYP MAX UNIT

VOUT

Output Voltage Accuracy (1)

Output Discharge Resistance

TPS62175 (adjustable Vout), VIN VOUT +1V

PWM Mode

Power Save Mode, L=10?H

TPS62177 (3.3V fixed Vout)

EN=Low

Sleep Mode, IOUT15mA PWM Mode

Power Save Mode,

Sleep Mode, IOUT15mA

VOUT 2.5V, COUT=22?F VOUT < 2.5V, COUT=44?F COUT=22?F, L=10?H

COUT=22?F, L=10?H

-1.8

1.8

-1.8

3

-1.8

3.7

-1.6

2.9 %

-2

2

-2

2.9

-1.6

2.7

175

Load Regulation Line Regulation

VOUT=3.3V, PWM mode operation VOUT=3.3V, IOUT= 500mA, PWM mode operation

0.02

%/A

0.015

%/V

(1) The output voltage accuracy in Power Save and Sleep Mode can be improved by increasing the output capacitor value, reducing the output voltage ripple (see APPLICATION INFORMATION section).

4

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TPS62175, TPS62177

SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014

DEVICE INFORMATION

DQC PACKAGE (TOP VIEW)

PGND 1 VIN 2 EN 3 NC 4 FB 5

Exposed Thermal Pad

10 VOS 9 SW 8 SLEEP 7 PG 6 AGND

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NAME PGND VIN EN NC

FB

AGND PG

SLEEP

PIN (1) NO. 1 2 3 4

5

6 7

8

SW

9

VOS

10

Exposed Thermal Pad

TERMINAL FUNCTIONS

I/O DESCRIPTION

Power ground connection.

I Supply voltage for the converter.

I Enable input (High=Enabled, Low= Disabled)

This pin is recommended to be connected to AGND but can left be floating.

I

Voltage feedback of adjustable version. Connect resistive divider to this pin. It is recommended to connect FB to AGND for fixed voltage versions for improved thermal performance.

Analog ground connection.

O Output power good. (open drain, requires pull-up resistor)

I

Sleep mode input (High=Normal Operation, Low=Sleep mode Operation). Can be operated dynamically during operation. If Sleep mode is not used, connect to VOUT.

O

Switch node, connected to the internal MOSFET switches. Connect inductor between SW and output capacitor.

I Output voltage sense pin and connection for the control loop circuitry.

Must be connected to AGND and PGND. Must be soldered to achieve appropriate power dissipation and mechanical reliability.

(1) For more information about connecting pins, see DETAILED DESCRIPTION and APPLICATION INFORMATION sections.

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TPS62175, TPS62177

SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014

FUNCTIONAL BLOCK DIAGRAM

PG

VIN

Soft start

Thermal Shtdwn

UVLO

PG control

EN* NC

td=1ms

control logic

power control

HS lim comp

gate drive



SW

SLEEP*

sleep control

VOS FB

175 EN

direct control &

compensation

_

error

+ amplifier

VREF

ramp

comparator

timer tON, tOFF

DCS - ControlTM

* This pin is connected to a pull down resistor internally (see Detailed Description section).

AGND

Figure 2. TPS62175 (adjustable output voltage)

PGND

6

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TPS62175, TPS62177

SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014

PG

VIN

Soft start

Thermal Shtdwn

UVLO

PG control

HS lim comp

EN*

td=1ms

control logic

power

gate

NC

control

drive

SW

SLEEP*

Sleep control

VOS FB

1.25M

175

400k EN

direct control &

compensation

_

error

+ amplifier

VREF

ramp

comparator

timer tON,tOFF

DCS - ControlTM

* This pin is connected to a pull down resistor internally (see Detailed Description section).

AGND

Figure 3. TPS62177 (fixed output voltage)

PGND

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TPS62175, TPS62177

SLVSB35B ? OCTOBER 2012 ? REVISED JANUARY 2014

PARAMETER MEASUREMENT INFORMATION



REFERENCE IC L1 Cin Cout R1 R2 R3

spacing spacing

VIN

List of Components

DESCRIPTION 28V, 0.5A Step-Down Converter, WSON 10uH, (4 x 4 x 1.2) mm 2.2?F, 50V, Ceramic, 0805, X5R 22?F, 6.3V, Ceramic, 0805, X5R depending on Vout depending on Vout 100k, Chip, 0603, 1/16W, 1%

10uH

VIN

SW

MANUFACTURER TPS62175DQC, Texas Instruments

LPS4012, Coilcraft Standard Standard

Standard

VOUT

EN TPS62175 VOS

R3

CIN

SLEEP

PG

R1

COUT

AGND

FB

PGND

NC

R2

Efficiency Output voltage Switching Frequency Quiescent Current Shutdown Current Power FET RDS(on) Maximum Output Current

Waveforms

Figure 4. Measurement Setup

TYPICAL CHARACTERISTICS Table of Graphs

DESCRIPTION vs Output Current, vs Input Voltage vs Output current (Load regulation) vs Input Voltage (Line regulation) vs Input Voltage vs Output Current vs Input Voltage vs Input Voltage vs Input Voltage (High-Side, Low-Side) vs Input Voltage Sleep Mode Transition Load Transient Response Line Transient Response Startup Output Discharge Typical Operation (PWM Mode, Power Save Mode, Sleep Mode, Short Circuit) Triangular Load Sweep with Mode Transitions

FIGURE 5 - 20 21 22 23 24 25, 26 27 28, 29 30 31, 32 33 - 38 39, 40 41 - 43 44

45 - 52

53, 54

8

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