EET 360 .edu



ECET 360

Surface Mount Technology

Sp 2011

Prof. Glenn R. Blackwell, Knoy 199C, 494-7726, blackwell@purdue.edu

Lecture MWF 12:30-1:20

Lab 2, W 3:30-5:20; Lab 3, W 7:30-9:20

Lecture Syllabus

Prerequisites: 1. Physics 218, Mechanics and Thermodynamics

2. EET 296/297/Electronic CAD knowledge.

Text:

• Blackwell, GR & Hollomon, JK, “Surface Mount Technology for PC Boards”.

Course Web Page: ; Blackboard

References:

• Intel Corp.: Packaging Handbook, 2000-2006. Santa Clara. Available at design/packtech/packbook.htm .

• Intel Corp.: Flash Memory Packaging. Santa Clara. Available at

• National Semiconductor Corp.: Packaging. Santa Clara. Available at

• Xilinx packaging. Available at:



• Blackwell, GR; The Electronics Packaging Handbook. IEEE/CRC Press, 2000, Boca Raton.

• Research International Corp.; Reflow Technology Handbook. Ronkokoma, NY.

PCB Design References:

• PCB Artist Tutorial, available at

• PCB Artist Library Creation Tutorial, available at

• PCB Artist User Tips Guide, available at

Course Objectives:

This course is deals with designing printed circuit boards (PCBs) and printed wiring boards (PWBs) that will use Surface Mount Technology (SMT). The learning objectives of the course are:

• Understand the process flow that a printed board using surface mount components (SMCs) goes through from design through fabrication, assembly, and test.

• Be able to demonstrate hand soldering techniques with surface mount devices (SMD’s)

• Learn a concurrent engineering approach to SMT design

• Apply the design, assembly and test criteria for a successful SMT printed board design

• Apply the principles of solder paste deposition and reflow soldering to create acceptable solder joints - solder joints account for 70% of SMT board failures!

• Be able to design, assemble, and test SMT-based printed circuit assemblies.

At the end of the course the student will understand these aspects, and have designed a PWB using SMT components, and assembled a printed circuit board using SMT components.

The course will approach SMT as a system: design, production, test, and repair will be considered concurrently. Lab topics will follow lecture topics in some areas, in others lab topics will stand alone. Lecture and lab together will develop understanding of the processes necessary for the design and development of a printed circuit board using surface mount devices.

It is assumed the student will enter the course with sufficient circuit design knowledge that this will not be a course topic except as it relates to the entire process. Mathematical treatments of thermal & mechanical issues may require an out-of-class review by students.

Grading: A = 90-100%

B = 80-89%

4 tests (includes final), drop 1: 45% of overall grade C = 70-79%

Class/team participation/assignments: 15% of overall grade D = 60-69%

Lab (70% minimum lab points to pass) 40% of overall grade F = Below 60%

Tests: will usually be oriented to the circuit board level. That is, if the topic being covered is soldering, a test or quiz question may ask how to reliably form solder joints on a circuit board. A test may involve the design of a particular board, with each question or set of questions adding more to the overall board design/layout. The final exam is considered one of the tests.

No makeup tests will be given.

It is always possible to cheat. Don't. Any cheating will receive a grade of 0. Second offences are sent directly to the DOS. You are expected to work together with other members on your lab team, however it will be made clear to you when you may turn in results/reports as a team, and when you are expected to turn in individual work. IN ALL CASES, any outside source must be referenced, whether it's from a book, magazine, the 'net, or personal conversations with industry personnel.

Lecture Schedule:

“Text Reads” in the tentative weekly table below refer to reading assignments in the text. Intel and Research International net references, and handout assignments are also noted. Text reads that say only “Chapt.” Or “Ch.” are in the textbook. You are expected to have the reading done by the day noted. Lectures will build on those readings. Reading quizzes will be given. Teams of students will periodically present information that has been gained from assigned readings/searches, and/or you will develop questions based on the reading material.

Lecture protocol: all beepers, cell phones, etc., must be off during lecture, or points will be deducted from your “participation” score. To participate in any quiz or test, hats and sunglasses must be removed.

Any actions which distract others or hinder their ability to learn are unfair to all students and will not be tolerated in the classroom. These actions can result in the loss of up to 100% of the possible course points.

Note that assignments are not shown below but will be announced during the semester. Supplements to the lecture schedule may be issued. The schedule may also change based on changes in the necessary flow of information, guest speakers, or new material.

Laboratory – a separate lab syllabus will be handed out in the first meeting of each lab division.

EET 360 Lecture Tentative Schedule

(For text and Intel readings, ignore info re ceramic packages unless specifically noted in lecture)

Assignments beyond reading assignments will be announced in lecture and on the course web page.

Dates Lecture Topics Text Reads Assign.

1-10, 12, 14 Intro. to Surface Mount Technology (SMT); Into to LLP W: National AN-1187 Intro. Cont’d, using the LLP F: Text Ch. 1

1-19, 21 IC Fabrication issues re SMT W: Intel Ch. 3.2-3.3.1, 3.3.3.5, 3.4, 3.6

SMT Devices/Packages. F: Ch. 2 thru 2.2.9

1-24, 26, 28 BGAs, μBGA, CSP, QFN/LLP M: Ch. 2.2.10 to end

W: Intel chapt. 14

F: Intel chapt. 15; Presentation topics

1-31,2- 2, 4 SMT Manufacturing overview M: Intel Ch. 7, Ch. 3 thru 3.1.3, 3.2

SMT Presentations – topics included in test 1 W. Presentations

SMT Presentations - topics included in test 1 F: Presentations

2-7, 9 SMT Placement M Ch 3.1.4, 3.3.3; W Test Review

Friday, 2-11 Test #1

2-14, 16, 18 SMT Soldering and Cleaning M: Ch. 3.1.6, 3.3 thru 3.3.2, 3.3.5-3.3.6

Reflow soldering, ovens, thermal profiling W: RI Reflow Handbook, Ch. 1, 2, 3, 5

Testing of SMT Assemblies F: Ch. 3.1.8, 3.3.7, 3.4, 3.5

2-21, 23, 25 Concurrent engineering, DFM, DFT M: Ch. 4

Pin in paste issues W: PIP pdf’s assignment

High Current/heat traces F:

2-28, 3-2,4 PCB Layout for SMT M: Ch. 5, -5.1

Layout: Ground and capacitor layout issues W Ch. 5.2 thru 5.4, Xilinx V5 PCB Design

Layout: vias and HDI F: Ch. 5.5

3-7, 9, 11 PCB Layout for SMT: Thermal Management M: Ch. 5.7 – 5.8

PCB Layout: Thermal mgmt.; ψJT W. h/o

PCB Layout: Thermal mgmt: student ?s F: Ch 6.4.1, handout

Spring Break!! March13-19

3-21, 23 PCB Assembly: vision system basics M: Ch. 7.2.1, 7.5, VS readings on 360 web site

Vision system applications; test review W:

Friday, 3-25 Test #2

3-28, 30, 4-1 Flexible Circuits M: 4pcb, Tips and Tools, Flexible Circuits, all

Flexible Circuits W: , Flex Circuits, all

Student Questions on Flex, Presentation topic selection F:

4-4, 6, 8 Flip Chips M: , tutorial #1; text pp. 77-82

Flip Chips, cont’d W: , tutorial #42

Student Questions F:

4-11, 13, 15 M: IPC & UL standards ,

W: Student Presentations

F: Students Presentations

4-18, 20, M: Lead-free solder paste M: Ch. 9.1, 9.2

W: Tin whiskers W: Ch. 9.8

Friday, 4-22- Test 3

4-25, 27, 29 M, W: Student Presentations, high-speed design

F: Course evaluation (required); Final review

Week 16: As Scheduled Really Final Exam, optional

References & Assignments:

Searching Google, the Engineering Index (Compendex) and/or the Applied Science and Technology index will show thousands of articles on SMT. Periodically you will be asked to read and summarize for the class articles about the week’s topics, or generate review questions based on the topic.

For review question assignments, here is the format that those questions and corresponding answers are to follow:

Each group of two students is to develop 10 “review” questions based on the reference(s) assigned. The format for each question of the assignment is:

• The question

• The answer

• The reference and the location in the reference from which the question and answer are taken.

A “review” question is one that attempts to determine that another reader of the work you are referencing does really understand what s/he just read. You’ve seen review questions in other courses, now you have a chance to write them.

Questions must relate to new information relative to that presented in 360, not a rehash of old information.

Questions and their answers may not duplicate those already covered in the review questions at the end of each text chapter

In general, asking what an acronym stands for is not sufficient. E.g. “what is HASL?” is not sufficient. “What is HASL and what are its shortcomings?” would be sufficient as a question.

• True/False questions are not acceptable.

• Yes/No questions are not acceptable.

• Questions may not be a sentence with one word removed, e.g., “BGAs have a ____ footprint”

• Obviously trivial questions are not acceptable – “How many leads does an SO14 have?”

• Multiple-choice with at least 3 answer options are OK.

Read each question after you write it to see if it leads the reader to a reasonable answer.

You may be asked to present the questions orally, or to turn them in as a written assignment.

Alternatively, for some classroom sessions, the instructor will ask questions of the students.

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