Package-in-Package: L/TFBGA-PiPs-SDx+y, LFBGA-PiPm-SDx+y
incorporate a 0.5mm to 0.4mm ball pitch. The PiP package can be assembled and board mounted like a conventional FBGA package and has equivalent package and board level reliability. Advantages 3D packaging is driven by wireless and consumer products that need package level functional integration in the smallest footprint, lowest ................
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