IEEE TRANSACTIONS ON POWER ELECTRONICS



258445-460375Call for PapersIEEE Journal of Emerging and Selected Topics in Power ElectronicsSpecial Issue on Resonant and Soft-Switching Techniques with Wide Bandgap Devices, 2018Scheduled Publication Time: March, 2019The development of wide bandgap (WBG) devices such as silicon carbide (SiC) and gallium nitride (GaN) power devices in recent years has resulted in power converters with power densities and efficiencies that are not possible with traditional silicon (Si) devices. While the fast switching speed of WBG devices enables higher converter efficiency and power density, a number of issues are created such as increased sensitivity to parasitics, EMI noise, high voltage and current overshoot and ringing, and heat centralization in semiconductor devices. Resonant and soft-switching techniques can be effective in resolving some of these issues by shaping switch waveforms so that they rise and fall gradually rather than suddenly. Even higher power densities and efficiencies can be achieved if they are also implemented with resonant and soft-switching techniques. Moreover, it is expected that resonant and soft-switching techniques can contribute to the wider adoption of WBG devices in many applications. Emerging resonant and soft-switching techniques for WBG converters are the main focus of this special issue. Innovative techniques with traditional Si devices are also welcome.Prospective authors are invited to submit original contributions, or survey papers in this special issue. Papers with applications in nature are particularly welcome. Topics of interest include, but are not limited to:Characterization of SiC or GaN devices and performance improvement with soft-switchingEvaluation of soft-switching converters with WBG or Si devicesComparative study between Si and WBG soft-switching convertersNovel resonant and soft-switching topologies and modulation schemesModeling and control of WBG resonant and soft- switching convertersImpact of soft-switching on the EMI of WBG soft-switching convertersDesign issues for WBG resonant or soft-switching circuits: gate drive, low parasitic layout, thermal design, packaging, integration technologiesHigh-frequency passive component design or integration for resonant soft-switching convertersResonant or soft-switching WBG converters, e.g. switching mode power supply, RF amplifier, EV chargers, wireless power transfer, grid inverter, etc. All manuscripts must be submitted through Manuscript Central at . Submissions must be clearly marked “Resonant and Soft-Switching Techniques with Wide Bandgap Devices” on the cover page. When uploading your paper, please select your manuscript type “Special Issue.” Refer to for general information about electronic submission through Manuscript Central. Manuscripts submitted for the special issue will be reviewed separately and will be handled by the guest editorial board noted below.Extension of Deadline for Submission of Manuscript: Sept. 1, 2018Guest Editors: Mark Dehong Xu, Zhejiang University, (xdh@cee.zju.)Gerry Moschopoulos, Western University (gmoschop@uwo.ca)Guest Associate Editors:Xibo Yuan, University of Bristol, UKAndrew Forsyth , University of Manchester, UK Dave Yates, Imperial College London, UKOscar Lucia, University of Zaragoza, Spain David J. Perreault, Massachusetts Institute of Technology, USAFrede Blaabjerg, Aalborg University, DenmarkJin Wang, Ohio University, USAYan-Fei Liu, Queen’s University, CanadaToshihisa Shimizu, Tokyo Metropolitan University, JapanJuan Manuel Rivas Davila, Stanford University, USAKhurram K. Afridi, University of Colorado Boulder, USA Martin Ordonez, UBC, CanadaQiang Li, Virginia Tech, USAZhiliang Zhang, Nanjing University of Aeronautics and Astronautics, China?Jung-Ik Ha, Seoul National University, KoreaJose Cobos, Universidiad Politecnica de Madrid, SpainProposed Timeline:Feb. 1, 2018 – Call for Papers to IEEE JESTPE Editorial OfficeSept. 1, 2018 – Manuscripts Submission DeadlineDec. 1, 2018 – Final Acceptance NotificationFeb. 1, 2018 – Manuscripts Forwarded to IEEE for Publication May 1, 2019 – Special Issue Appears in IEEE JESTPE ................
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