FC-PBGA, Flip Chip Plastic Ball Grid Array (FC-PBGA)

TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t

he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony

are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack,

ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ

Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property

of their respective owners. ? 2011 Freescale Semiconductor, Inc.

Table of Contents

Slide

1.

FC-PBGA Package Configurations

2.

Printed Circuit Board Design for FC-PBGA

11

3.

Surface Mount Assembly

16

4.

Component Level Qualification

29

5.

Board-Level Reliability

31

6.

Thermal Performance

38

TM

2

3

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore

and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a

Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners. ? 2011 Freescale Semiconductor, Inc.

TM

FC-PBGA Package Configurations

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t

he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony

are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack,

ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ

Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property

of their respective owners. ? 2011 Freescale Semiconductor, Inc.

Many Freescale high performance products require the performance

advantages of a flip chip Ball Grid Array (BGA) package. Flip chip

packages are offered in bare die, flat lid and full lid configurations.

Bare Die Configuration

Flip Chip Solder Bump

Capacitor

Underfill

Silicon Die

Flat Lid Configuration

Lid / Heat Spreader

Flip Chip Solder Bump

Thermal Interface Material

Capacitor

Underfill

Silicon Die

Package Substrate

BGA Solder Ball

TM

Package Substrate

BGA Solder Ball

4

Full Lid Configuration

Thermal Interface Material

Flip Chip Solder Bump

Lid

/

Heat

Spreader

Underfill

Capacitor

Silicon Die

Package Substrate

Lid Adhesive

BGA Solder Ball

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore

and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a

Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners. ? 2011 Freescale Semiconductor, Inc.

Freescale FC-PBGA packages feature either a high-lead solder

bump soldered to the package substrate with a eutectic tin-lead

solder or a lead-free bump

Typical High-Lead Solder Bump Interconnect Die Typical Pb-Free Solder Bump Interconnect

Under Bump

Metallurgy (UBM)

Bump

Package Substrate Copper Pad

TM

5

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore

and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a

Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners. ? 2011 Freescale Semiconductor, Inc.

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