Survey of Rework Methods/Equipmentand Contract ...
The packaged device will settle to a position above the board that balances the forces between the mass of the package and the number of solder balls that support the device as well as the solder pad diameter. A relatively light device and a high number of solder balls will settle with a higher standoff height than a relatively heavy device with a low number of solder balls. Lower standoff ... ................
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