CMP PRESENT AND FUTURE TECHNICAL AND ECONOMIC …
CMP PRESENT AND FUTURE TECHNICAL AND ECONOMIC CHALLENGES
AVS CMPUG SEMICON WEST 2014 MEETING
Albany Nano Tech Advanced Planarization Center
SUNY CNSE: Frank Tolic,Tricia Burroughs, Brett Baker-O'Neal, Chris Borst SEMATECH: Richard Hill, Chris Hobbs, Bill Ross, Edward Barth,
Satyavolu Papa Rao
Executive Summary
? Problem Statement: CMP R&D constrained by cost/access to leading edge materials, tools, metrology and test vehicles.
? Objective: Establish a Planarization Center to enable supply chain development/benchmarking and accelerate process maturity for end users
? Approach: 1) Leverage the SEMATECH network to design an industry-standard mask-set 2) Establish a partnership ecosystem using CNSE's leading edge fabrication, engineering, metrology/defect toolsets, and university network 3) Fully engage the CMP community (consumable, tool, metrology) and end-user stakeholders (IDM, foundry, fabless, EDA)
June 20, 2014
WWW.
InP ART CMP 200 nm
32nm Cu M1
Technology Outlook
And new channel materials
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New Growth
Emerging Technology & New Materials driving growth. How to manage costs?
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Wafer Size
MPU NAND
MPU NAND
Must start addressing these cost challenges now!
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CMP Challenges
CoO reduction
Increasing stringent process targets
Defect reduction
Supply chain access to
advanced test structures
Tightening ESH regulations
Supply chain access to
shared BKM development
platform
CMP solutions for new materials
Planarization center: Accelerate solutions to address industry challenges
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Planarization Center Beneficiaries
IDMs
Slurry Suppliers
Pad Suppliers
Fabless & EDA
Pad Condition
Gov't Agencies
Clean Solutions
CMP Tools
Integrated Planarization Center
Metro and
Defect Tools
Waste Treatment
Slurry delivery
& filtration
Offers benefits to entire CMP community
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Planarization Center Cost Advantages
Variable Cost
Potential Cost Reduction
Cost $
Fixed Cost
Depreciation
Direct Labor Facility
Variable Cost
Captive
Partnership
Using a shared research model provides Significant Cost Savings!
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