Supplier Name:



Q104 Qualification Test PlanAutomotive Grade Level = FORMDROPDOWN MSL = FORMDROPDOWN Supplier Name: FORMTEXT ?????General Specification:AEC-Q104 Rev. -Supplier Code: FORMTEXT ?????Supplier Wafer Fabrication: FORMTEXT ?????Supplier Part Number: FORMTEXT ?????Supplier Wafer Test: FORMTEXT ?????Supplier Contact: FORMTEXT ?????Supplier Assembly Site: FORMTEXT ?????Supplier Family Type: FORMTEXT ?????Supplier Final Test Site: FORMTEXT ?????Device Description: FORMTEXT ?????Supplier Reliability Signature: FORMTEXT ?????PPAP Submission Date: FORMTEXT ?????Customer Test ID: FORMTEXT ?????Reason for Qualification: FORMDROPDOWN Customer Part Number: FORMTEXT ?????Prepared by Signature: FORMTEXT ?????Date: FORMTEXT ?????Customer Approval Signature: FORMTEXT ?????Date: FORMTEXT ?????Test#ReferenceTest ConditionsLotsS.S.TotalResultsLot/Pass/FailComments:(N/A =Not Applicable)Test Group A – Accelerated Environment Stress TestsPCA1JESD22 A113J-STD-020Preconditioning: (Test @ Rm)SMD only; Moisture Preconditioning for THB/HAST, AC/UHST, TC, & PTC; Peak Reflow Temp = FORMTEXT ?????Min. MSL = 3MSL = FORMTEXT ????? FORMTEXT ?????THBorHASTA2 JESD22 A101JESD22 A110Temperature Humidity Bias: (Test @ Rm/Hot) FORMTEXT ?????Highly Accelerated Stress Test: (Test @ Rm/Hot/) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????AC orUHSTor THA3 JESD22 A102JESD22 A118or JESD22-A101Autoclave: (Test @ Rm)Unbiased Highly Accelerated Stress Test: (Test @ Rm)Temperature Humidity without Bias: (Test @ Rm) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????TCA4JESD22 A104Temperature Cycle: (Test @ Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????PTCA5JESD22 A105Power Temperature Cycle: (Test @ Rm/Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????HTSLA6JESD22 A103High Temperature Storage Life: (Test @ Rm/Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????Test Group B – Accelerated lifetime simulation testsHTOLB1JESD22 A108High Temp Operating Life: (Test @ Rm/Cold/Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????ELFRB2AEC-Q104Appendix 2Early Life Failure Rate: (Test @ Rm/Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????EDRB3AEC-Q100-005NVM Endurance & Data Retention Test: (Test @ Rm/Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTSWBSC1AEC-Q100-001AEC-Q003Wire Bond Shear Test: (Cpk > 1.67) FORMTEXT ?????30 bonds5 MCMsMin. FORMTEXT ????? bonds FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????WBPC2Mil-STD-883,Method 2011AEC-Q003Wire Bond Pull: (Cpk > 1.67); Each bonder used FORMTEXT ?????30 bonds5 MCMsMin. FORMTEXT ????? bonds FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????SDC3JESD22 B102JSTD-002DSolderability: (>95% coverage)8hr steam aging prior to testing FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????PDC4JESD22 B100, JESD22 B108AEC-Q003Physical Dimensions: (Cpk > 1.67) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????SBSC5AEC-Q100-010AEC-Q003Solder Ball Shear: (Cpk > 1.67); 5 balls from min. of 10 MCMs FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN balls FORMTEXT ????? balls FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????LIC6JESD22 B105Lead Integrity: (No lead cracking or breaking); Through-hole only; 10 leads from each of 5 MCMs FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN leads FORMTEXT ????? leads FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????XRAYC7X-ray: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ?????AMC8Acoustic Microscopy: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ?????TEST GROUP D – DIE FABRICATION RELIABILITY TESTSEMD1JEP001Electromigration: FORMTEXT ?????--- FORMTEXT ?????Data Available FORMTEXT ?????TDDBD2JEP001Time Dependant Dielectric Breakdown: FORMTEXT ?????--- FORMTEXT ?????Data Available FORMTEXT ?????HCID3JEP001Hot Carrier Injection: FORMTEXT ?????--- FORMTEXT ?????Data Available FORMTEXT ?????NBTID4JEP001Negative Bias Temperature Instability: FORMTEXT ?????--- FORMTEXT ?????Data Available FORMTEXT ?????SMD5JEP001Stress Migration: FORMTEXT ?????--- FORMTEXT ?????Data Available FORMTEXT ?????TEST GROUP E- ELECTRICAL VERIFICATIONTESTE1User/Supplier SpecificationPre and Post Stress Electrical Test: FORMTEXT ?????AllAllAll FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????HBME2AEC-Q100-002ANSI/ESDA/JEDEC JS-001Electrostatic Discharge, Human Body Model:(Test @ Rm/Hot); (1KV HBM / Class 1C or better) FORMTEXT ????? FORMDROPDOWN FORMTEXT ???? FORMTEXT ????? FORMTEXT ????? of FORMTEXT ?????ESD Level = FORMDROPDOWN FORMTEXT ?????CDME3AEC-Q100-011ANSI/ESDA/JEDEC JS-002Electrostatic Discharge, Charged Device Model: (Test @ Rm/Hot); (500V / Class C4A or better) FORMTEXT ????? FORMDROPDOWN FORMTEXT ???? FORMTEXT ????? FORMTEXT ????? of FORMTEXT ?????ESD Level = FORMDROPDOWN FORMTEXT ?????LUE4AEC-Q100-004Latch-Up: (Test @ Rm/Hot) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????EDE5AEC-Q100-009AEC-Q003Electrical Distributions: (Test @ Rm/Hot/Cold) (where applicable, Cpk >1.67) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????FGE6AEC-Q100-007Fault Grading: FORMTEXT ?????---Fault Grade FORMDROPDOWN FORMTEXT ?????CHARE7AEC-Q003Characterization: (Test @ Rm/Hot/Cold) FORMTEXT ?????--- FORMDROPDOWN FORMTEXT ?????EMCE8SAE J1752/3Electromagnetic Compatibility (Radiated Emissions) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ?????SERE9JESD89-1JESD89-2JESD89-3Soft Error Rate FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ?????LFE10AEC-Q005Lead (Pb) Free: (see AEC-Q005)--- FORMTEXT ????? FORMTEXT ?????TEST GROUP F – DEFECT SCREENING TESTSPATF1AEC-Q001Process Average Testing: (see AEC-Q001)AllAllAllReject units outside Avg. FORMTEXT ?????SBAF2AEC-Q002Statistical Bin/Yield Analysis: (see AEC-Q002)AllAllAllReject units outside criteria FORMTEXT ?????TEST GROUP G – CAVITY MODULE INTEGRITY TESTSMSG1JESD22 B110Mechanical Shock: (Test @ Rm) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????VFVG2JESD22 B103Variable Frequency Vibration: (Test @ Rm) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????CAG3MIL-STD-883Method 2001Constant Acceleration: (Test @ Rm) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????GFLG4MIL-STD-883Method 1014Gross and Fine Leak: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????DROPG5JESD22-B110Mechanical Shock Cavity Drop Test: (Test @ Rm) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????LTG6MIL-STD-883Method 2024Lid Torque: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????DSG7MIL-STD-883Method 2019Die Shear: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????IWVG8MIL-STD-883Method 1018Internal Water Vapor: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????TEST GROUP H – MODULE SPECIFIC TESTSBLRH1IPC-9701Board Level Reliability: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????LTSLH2JESD22 A119Low Temperature Storage Life: (Test @ Rm/Hot/Cold) FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????STEPH3ISO 16750-4Start Up and Temperature Steps: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????MCM DROPH4JESD22-B111MCM Drop Test: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? of FORMTEXT ????? FORMTEXT ?????DPAH5MIL-STD-1580Destructive Physical Analysis: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ?????XRAYH6X-ray: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ?????AMH7Acoustic Microscopy: FORMTEXT ????? FORMDROPDOWN FORMDROPDOWN FORMDROPDOWN FORMTEXT ????? FORMTEXT ????? ................
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